Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

35 Years of Innovation from Jena: GÖPEL electronic Celebrates Its Anniversary

05/19/2026 | GÖPEL electronic
In May 2026, GÖPEL electronic will celebrate its 35th anniversary. Founded in 1991 as a spin-off of Carl Zeiss Jena Measurement and Testing Technology, the company has continuously evolved and is now one of the world’s leading providers of innovative test and inspection systems, with approximately 240 employees as well as locations and partners in more than 25 countries.

PCB East 2026: AI Infrastructure, Advanced PCB Technologies, and the Future of Electronics Manufacturing

05/19/2026 | Doug Dixon, 360Circuits
After attending PCB East 2026, it became clear to me that the electronics industry is entering a major transition driven by AI infrastructure, increasing power density, and growing system complexity, extending far beyond semiconductors alone. What stood out was how critical PCB technology, materials science, thermal management, and advanced manufacturing have become to the future of electronics. The industry is now facing many challenges, including tighter manufacturing tolerances, material shortages, rising costs, and growing pressure to digitally transform engineering and manufacturing operations.

Packet Digital Awarded $9.8M U.S. Navy Contract to Scale Battery Cell Production

05/18/2026 | Packet Digital
Packet Digital, and its subsidiary Badland Batteries, a U.S.-based leader in advanced lithium-ion battery technology for drones, unmanned aerial systems (UAS) and other defense applications, announced today that it has been awarded $9.8 million as it moves to Phase 3 of its U.S. Navy contract under the Logistics UAS Family of Advanced Batteries program.

SEMI, 23 Member Companies Urge U.S. Congress to Extend Advanced Manufacturing Investment Credit

05/18/2026 | SEMI
SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, and 23 member companies on the SEMI Tax Policy Committee, issued a letter to the U.S. Congress urging immediate passage of a multi-year extension of the Advanced Manufacturing Investment Credit (AMIC).

Express Manufacturing, Inc. Expands Inspection Capabilities with Its 2nd TRI AXI

05/18/2026 | Express Manufacturing, Inc.
Express Manufacturing, Inc. (EMI), a global electronics manufacturing services (EMS) provider, has added a new TR7600FB SII from Test Research, Inc., further strengthening its inspection capabilities for complex, high-reliability assemblies.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in