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Indium Features Preforms and Reinforced Solder Ribbon at APEC 2018
February 1, 2018 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS, at APEC 2018, to be held March 4-8 in San Antonio, Texas.
Indium is redefining solder with its InFORMS preforms and patent-pending solder ribbon for automated assembly.
According to Seth Homer, Product Manager, InFORMS are a composite fabrication consisting of solder and a reinforcing matrix that stabilizes bondline thickness. "Using an InFORM between the baseplate and substrate will ensure bondline planarity, giving your assembly a much more stable joint and increasing the reliability of your end product," he says.
InFORMS are invaluable in the production process because they provide:
- A drop-in replacement for other bondline control methods
- Increased lateral strength
- Bondline co-planarity
- Improved thermal cycling reliability
InFORMS are available in a variety of alloys, including SAC and SnPb alloys.
For more information about InFORMS, click here.
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