The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Indium’s Sandy-Smith to Lead Panel at IPC APEX EXPO 2018
February 9, 2018 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation’s Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will lead a special panel discussion of industry experts at the IPC APEX EXPO technical conference on Thursday, March 1 in San Diego, California.
The Buzz Session, led by Sandy-Smith, will start at 10:30 am on March 1 and cover Test Methods for Assessing Ionic Cleanliness. The electronics industry continues to search for updated test methods designed to accurately assess ionic cleanliness. While the incumbent Resistivity of Solvent Extract (ROSE) method is no longer considered the best method, emerging methods have yet to reach the level of industry standardization. Process, materials, and assembly experts will discuss the important factors to be considered when choosing the best method to test ionic cleanliness.
Panel participants include:
- David Lober, Process Chemist, Kyzen Corporation
- Douglas Pauls, Principle Materials Process Engineer, Rockwell Collins
- Jason Fullerton, Alpha Assembly Solutions
- Terry Munson, Foresite, Inc.
- Graham Naisbitt, Gen3 Systems
For more information about this session, click here.
Brook Sandy-Smith is a leader in the industry for technical knowledge and support. As a Technical Support Engineer based at Indium Corporation’s headquarters in Clinton, NY, she specializes in PCB Assembly Materials and works closely with customers to develop custom solutions and optimize their processes. Sandy-Smith has a passion for developing and implementing standardization for test methods, and is an SMTA Certified Process Engineer. She is active in several IPC committees, SMTA programs, and iNEMI projects, and currently serves as chair of the J-004 committee and as Vice President of technical programs for the SMTA Empire chapter. Brook graduated from the International Engineering Program at the University of Rhode Island with a degree in Chemical Engineering and German language.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, click here.
Share on:
Suggested Items
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Zhou (Peter) Guoyin: Pioneering the Standardization of ESG
12/23/2024 | Chuck Li, IPC AsiaWith more than 30 years of experience in corporate social responsibility (CSR) and environmental, social, and governance (ESG), Zhou (Peter) Guoyin has not only witnessed the evolution of CSR and ESG globally but has also been a key force in driving their development. As chair of the IPC-1401 standard committee, Zhou has led numerous innovative projects over the past 11 years and was awarded the SEDEX Supply Chain Impact Award in August 2024. In this exclusive interview, he shares valuable insights into the ESG field and the profound impact of IPC-1401 on the electronics manufacturing industry.
Are Our Stackup Rules No Longer Valid?
12/19/2024 | Cherie Litson, EPTAC MIT CID/CID+Are the stackup rules we used to follow no longer valid? It depends on what you’re designing. Electrical rules change depending on your circuit. Fabrication rules change depending on which fabricator you’re working with. Today, we just have more options, and sometimes, cost is a bigger rule than anything else. If you search online for information about layer stackups, trace widths, and hole sizes in PCBs, you’ll find a variety of resources.
IPC/WHMA Launches Groundbreaking Online Course on Wire Harness Design
12/18/2024 | IPCIPC/WHMA is excited to announce the launch of its new online instructor-led training course, "Introduction to Wire Harness Design I," available now through the IPC EDGE Learning Management System.
IPC Releases Latest List of Standards and Revisions
12/17/2024 | IPC Community Editorial TeamEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q4 2024.