Dan’s Biz Bookshelf: ‘Born to Create’
It’s Only Common Sense: Invest in Yourself—You’re Your Most Important Resource
Marcy's Musings: Engineering Economics
Aismalibar North America to Exhibit at Strategies in Light
February 12, 2018 | AismalibarEstimated reading time: 1 minute
Aismalibar will exhibit at the Strategies in Light trade show in Anaheim, California on February 13-15, 2018. Strategies in Light is the leading LED and lighting event in North America and has been for more than 15 years. Aismalibar North America can be found at booth 328 and encourages all to come see their cutting edge thermal management solutions.
Aismalibar will be showcasing their newest high technology Insulated Metal Substrate - Cobritherm Ultra-Thin. Aismalibar developed Ultra-Thin with a dielectric layer thickness of only 35 microns that provides higher thermal performance and excellent working temperatures. This product is well suited for high end LED applications.
In addition, Aismalibar will be featuring FASTHERM. This product is used to achieve a faster thermal transition from the LED thermal pad to the heat sink. This technology allows LEDs operate at a temperature 30°C to 50°C lower due to the direct thermal transition from the thermal pad to the heat sink. This superior thermal transition can be achieved by using the entire COBRITHERM HTC product range with either a copper or copper/aluminium base.
About Aismalibar
Aismalibar is a manufacturer of copper clad laminates who produces high quality base materials for the PCB industry. Our products provides superior thermal management through high thermal conductivity, low thermal impedance and high dielectric capacity. AISMALIBAR was one of the first IMS laminate manufacturers in the world and was the first in Europe. AISMALIBAR is proud to introduce their material to the North American market in 2012. Their product IMS Cobritherm ® is a qualified and recognized Insulated Metal Substrate which gives the best thermal management solutions with high thermal conductivity, low thermal impedance and high dielectric capacity. AISMALIBAR has implement a 100% proof test with 1-3KV (High Pot Test) to all IMS laminates coming out of their plant. This is the only way to insure the dialectical strength is perfect and that production problems are detected before PCBs arrive to the end user.
Share on:
Suggested Items
Fresh PCB Concepts: PCB Design Essentials for Electric Vehicle Charging
11/27/2024 | Team NCAB -- Column: Fresh PCB ConceptsElectric vehicles (EVs), powered by electricity rather than fossil fuels, are transforming transportation and reducing environmental impacts. But what good is an EV if it can't be easily charged? In this month's column, Ramon Roche dives into the role of printed circuit boards (PCBs) in electric vehicle charging (EVC)—and the design considerations.
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.