-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young to Showcase KSMART Process Optimization on MPM Printer at IPC APEX EXPO 2018
February 13, 2018 | Koh Young TechnologyEstimated reading time: 1 minute
Koh Young Technology will be demonstrating its KSMART Process Optimization (KPO) on an MPM printer at the upcoming IPC APEX EXPO in San Diego, which will be held from February 27–March 1. Koh Young will be in Booth 2733). ITW EAE, the Electronic Assembly Equipment division of ITW, is collaborating with Koh Young to bring this value added technology to its MPM printer line.
KPO analyzes printed boards and interfaces with MPM’s Benchmark software, through Open Apps source code, to provide data on key parameters. Process Engineers get feedback on recommended squeegee force, print speed, board separation and wipe frequency to improve print quality, reduce waste and increase yield. KPO significantly reduces the time and effort to establish optimum print parameters for an assembly, taking control of the printer to run test boards automatically designed and executed by KPO, then performing detailed analysis of the SPI results to determine the optimum print parameters.
"By working together with Koh Young, we are able to bring a valuable asset to the MPM printer line that enables printer process optimization for higher yield to our customers and will reduce setup time and save process engineering time," said Wayne Wang, ITW EAE Printer Group Business Manager. "While this is a great step forward, we are continuing our work with Koh Young to bring additional KPO technologies to the MPM line."
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).