IMAPS to Celebrate 50th Anniversary at MicroTech 2018

Estimated reading time: 2 minutes

IMAPS-UK, a European chapter of the International Microelectronics Assembly and Packaging Society (IMAPS), is celebrating its 50th anniversary. To mark the occasion, the MicroTech 2018 conference, to be held April 10 at the Royal Holloway College, University of London, will carry the theme "Moore than Packaging: 50 Years Gone, 50 Years On!"

The conference will comprise nine presentations on subjects such as Advanced Packaging, The Evolution of Photonics Packaging, Flip-chip Bonding (and How to Meet High Accuracy Requirements) and Surface Metrology for Wirebond Inspection. In addition, a Gala Dinner will be held the evening before (9th April). It will see awards presented to ‘Company of the Year’ and ‘Individual of the Year’. Also, Dr Peter Barnwell, Past International President, current UK Treasurer and one of the founding members of the International Society for Hybrid Microelectronics (ISHM, the forerunner of IMAPS) in 1968, is a guest speaker. He will be followed by Malcom Penn, Chairman and CEO of Future Horizons, who will review the history of the industry and comment on its future, which will be further explored during the conference.

Dr. Chris Hunt, present Chair of IMAPS-UK and founder of Pireta, comments, "The MicroTech conferences are going from strength-to-strength and bring together like-minded individuals and experts from within the microelectronics sector, there to discuss the latest technologies, developments and commercial opportunities."

MicroTech 2018 is open to researchers, scientists, product designers, process and production engineers, end users and students. Separate tickets are required for the Gala Dinner on April 9 and the conference on April 10.

Interested parties should register online at www.imaps.org.uk where pricing details and a full agenda for MicroTech 2018 can be found.

About IMAPS

The International Microelectronics Assembly and Packaging Society (IMAPS) is a global community of electronics and microelectronic packaging engineers. It comprises three geographical groupings of IMAPS chapters; in America, Europe and Asia. These groupings tend to concentrate on events in their geographic regions.   

The society has significant cross-participation, which benefits engineers in all regions, and members have access to information through seminars, workshops, market and business events, short courses, publications, webinars and websites. These platforms are available to all members. Also, much of the information is freely available to non-members. For further information please click here.