Alpha Insights, Performance by Design: The Future of PCB Manufacturing in the Midwest
Happy’s Tech Talk #43: Engineering Statistics Training With Free Software
It’s Only Common Sense: Stop Whining About the Market—Outwork It
IMAPS to Celebrate 50th Anniversary at MicroTech 2018
February 14, 2018 | IMAPSEstimated reading time: 1 minute
IMAPS-UK, a European chapter of the International Microelectronics Assembly and Packaging Society (IMAPS), is celebrating its 50th anniversary. To mark the occasion, the MicroTech 2018 conference, to be held April 10 at the Royal Holloway College, University of London, will carry the theme "Moore than Packaging: 50 Years Gone, 50 Years On!"
The conference will comprise nine presentations on subjects such as Advanced Packaging, The Evolution of Photonics Packaging, Flip-chip Bonding (and How to Meet High Accuracy Requirements) and Surface Metrology for Wirebond Inspection. In addition, a Gala Dinner will be held the evening before (9th April). It will see awards presented to ‘Company of the Year’ and ‘Individual of the Year’. Also, Dr Peter Barnwell, Past International President, current UK Treasurer and one of the founding members of the International Society for Hybrid Microelectronics (ISHM, the forerunner of IMAPS) in 1968, is a guest speaker. He will be followed by Malcom Penn, Chairman and CEO of Future Horizons, who will review the history of the industry and comment on its future, which will be further explored during the conference.
Dr. Chris Hunt, present Chair of IMAPS-UK and founder of Pireta, comments, "The MicroTech conferences are going from strength-to-strength and bring together like-minded individuals and experts from within the microelectronics sector, there to discuss the latest technologies, developments and commercial opportunities."
MicroTech 2018 is open to researchers, scientists, product designers, process and production engineers, end users and students. Separate tickets are required for the Gala Dinner on April 9 and the conference on April 10.
Interested parties should register online at www.imaps.org.uk where pricing details and a full agenda for MicroTech 2018 can be found.
About IMAPS
The International Microelectronics Assembly and Packaging Society (IMAPS) is a global community of electronics and microelectronic packaging engineers. It comprises three geographical groupings of IMAPS chapters; in America, Europe and Asia. These groupings tend to concentrate on events in their geographic regions.
The society has significant cross-participation, which benefits engineers in all regions, and members have access to information through seminars, workshops, market and business events, short courses, publications, webinars and websites. These platforms are available to all members. Also, much of the information is freely available to non-members. For further information please click here.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Keysight Unveils 3GPP AI Simulation Platform to Accelerate AI-enabled 6G Communications
10/01/2025 | BUSINESS WIREKeysight Technologies, Inc. announced the release of WirelessPro 3GPP AI Simulation Platform (WirelessPro), a next-generation software platform designed to meet the evolving needs of wireless communication system engineers.
Fresh PCB Concepts: Investing in Tomorrow's PCB Experts Today
09/24/2025 | Team NCAB -- Column: Fresh PCB ConceptsPeople often describe the PCB industry as one of the most critical yet invisible foundations of modern electronics. Every project needs a PCB, but few college programs or engineering curricula cover the complexity of board design, stackups, or manufacturability. That means the responsibility for developing the next generation of PCB experts falls on the industry itself.
Blueshift Launches PhaseBlue 1500 Series Circuit Material
09/22/2025 | BlueshiftBlueshift, a U.S.-based technology leader in advanced materials, is introducing PhaseBlue® 1500, the first product in its Series Circuit Materials (SCM) line at this year’s (2025) European Microwave Show.
TTCI Returns to SMTAI with Focus on Functional Test, ICT, and Training Excellence
09/22/2025 | TTCIThe Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions for more than 45 years, will exhibit in Booth 2403 at SMTA International 2025, taking place October 19–23 at the Donald E. Stephens Convention Center in Rosemont, Illinois. TTCI will spotlight its advanced test capabilities and full-service approach to tackling complex product validation challenges.
HyRel Technologies Showcases Summer Intern Success Through Hands-On Innovation
09/16/2025 | HyRel TechnologiesHyRel Technologies, a global provider of quick turn semiconductor modification solutions, proudly highlights the accomplishments of its two recent summer interns, Danny Hoang and Nisarg Jadav.