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Indium Features Metal Thermal Interface Materials for Burn-In and Test at BiTS Workshop 2018
February 15, 2018 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation will feature its metal thermal interface materials for burn-in, including Heat-Spring and HSMF-OS, at Burn-in & Test Strategies Workshop on March 4-7 in Mesa, Arizona.
Indium Corporation’s Heat-Spring is designed for use in the burn-in process. It is patterned to optimize contact with non-planar surfaces with a pressure range of only 35-100+ psi. Heat-Spring is available in InAg and InSn alloys and pure indium.
HSMF-OS has a multi-layer construction with a total thickness of 0.004” that is designed for multiple insertions. It has an aluminum layer that acts as an interface with the device under test, and has a tensile strength of approximately 90 MPa with a soft, compliant polymer backing, which provides a configuration with “designed-in” insertion survivability.
To learn more about Indium Corporation’s metal thermal interface materials for burn-in and test, click here.
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