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RTW IPC APEX EXPO: DIS Introduces Enhanced Pinless Multilayer Layup System
March 5, 2018 | Real Time with...IPCEstimated reading time: Less than a minute
DIS introduces an enhanced version of their established pinless multilayer layup system now capable of handling flex and rigid-flex constructions. Jesse Ziomek explains.
To watch the interview, click here.
Suggested Items
All Flex Solutions Upgrades Lamination Layup
01/17/2025 | All Flex SolutionsAll Flex Solutions has invested in Ulrich Rotte lamination layup stations in their rigid flex layup area. The Ulrich Rotte stations automate the layup process by handling the lamination plates, which are heavy, and sequencing the layup process for the operators.
Expansion, Retirement, and New Leadership at FCT
01/09/2025 | Marcy LaRont, PCB007 MagazineIn the dynamic landscape of interconnect solutions, Flexible Circuit Technology (FCT) is making waves through significant leadership changes and expansion initiatives. Vice President Carey Burkett, newly appointed executive vice president Ray Cottrell, and marketing director Abby Meyer share their vision for steering the company toward innovative growth. FCT has a robust focus on diverse markets such as medical, automotive, consumer electronics, and HDI (high density interconnect). They are accelerating FCT’s mission to provide exceptional value and service to customers throughout the product lifecycle.
Flex Completes Acquisition of Crown Technical Systems
12/04/2024 | PR NewswireFlex recently announced that it has completed its previously announced $325 million all-cash acquisition of Crown Technical Systems, a leader in fully integrated power distribution and protection systems.
Flex PCB Design Best Practices with Dave Lackey
12/04/2024 | Brittany Martin, I-Connect007David Lackey, a flex circuit expert at American Standard Circuits, speaks about the advantages and challenges of designing with flexible and rigid-flex PCBs. He also discusses how consulting before the design phase can save time and costs by avoiding manufacturing issues and highlights the reliability and packaging benefits of flex technology, especially for compact designs in sectors like aerospace.
Flexible Electronics Market to Reach $75.04 Billion by 2032
12/03/2024 | Globe NewswireThe SNS Insider report indicates that,“The Flexible Electronics Market Size was valued at USD 32.65 Billion in 2023 and is expected to reach USD 75.04 Billion by 2032 and grow at a CAGR of 9.72% over the forecast period 2024-2032.”