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All Flex Expands Reach Through Flex Interconnect Technologies Acquisition

08/19/2026 | Marcy LaRont, I-Connect007
A strategic partnership between Minnesota-based All Flex Solutions and Flex Interconnect Technologies (FIT) will provide value-added engineering and quick-turn, prototype flexible PCB manufacturing with All Flex’s high-volume flex fabrication. The new alliance offers customers a more comprehensive flex solution and an opportunity to streamline their flex PCB supply chain. All Flex CEO John Fallon discusses the strategic rationale behind the partnership, the benefits of having a “100-year plan,” and how the combined organization is positioning itself for optimum growth.

August I-Connect007 Magazine: The Electronics Ecosystem From Design to Development

08/18/2026 | I-Connect007 Editorial Team
This issue of I-Connect007 Magazine examines how collaboration across the electronics ecosystem—from design through fabrication, packaging, AI infrastructure, and flexible circuits—drives innovation and manufacturable products. Our contributors explore co-design from multiple perspectives, using analogies from the forest to the Olympics. We also revisit VeCS for high layer count HDI PCB fabrication, plating challenges for advanced packaging, new applications for flex circuits in robots, and how the U.S. national defense policy could affect PCB sourcing.

Marcy’s Musings: The Power of the Electronics Ecosystem

08/19/2026 | Marcy LaRont -- Column: Marcy's Musings
Electronics hardware product design and manufacturing is a completely interconnected (pun intended) and interdependent system. Success depends on every part of the ecosystem functioning together, a reality that once seemed easy to ignore or sideline, but today, few have the time or resources to work independently.

IPC Standards Released for Q2 2026

08/14/2026 | Global Electronics Association
Each quarter, the Global Electronics Association releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit electronics.org/ipc-standards. These are the latest releases for Q2 2026.

I-Connect007 Welcomes New Columnists from Flexible Circuit Technologies

08/12/2026 | I-Connect007
In an exciting new column for I-Connect007 Magazine, a team of application engineers from Flexible Circuit Technologies will draw on decades of experience designing and manufacturing flex and rigid-flex circuits to offer practical guidance to help PCB designers make better engineering decisions. Mark Finstad, Chris Clark, Terrill Schmidt, Dan Skweres, and Zack Schaner will rotate authoring the new column, called Flex Connections, which begins in the August issue, with Dan drawing on his many years of experience to explain why just because you can do something in PCB design, doesn’t mean you should.
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