-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
IPC Publishes Standard on Low-Pressure Molding for Circuitry Encapsulation
March 19, 2018 | IPCEstimated reading time: 1 minute
IPC announces a new standard, IPC-7621, Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics, a guidance document that offers instruction on using Low Pressure Molding (LPM) in place of potting for circuitry encapsulation.
Unlike potting, where the potting vessel becomes the outer “shell” of the encapsulated part, LPM utilizes mold tooling which is removable and re-useable. LPM also creates a physical layer, providing mechanical and environmental protection for handling and mounting the component device.
Typically, potting vessels are filled with potting compound which hardens in the vessel, causing the vessel to become part of the potted assembly. LPM requires no such vessel and can be molded into a desired form. LPM is commonly done with polyamide (PA) polymer, a thermoplastic, that is brought to liquid state, encapsulating electronic assemblies into a desired form or shape. After the material has cooled, a thick plastic layer remains, working as a protective, sealed barrier. This layer protects the board and components from the environment.
“LPM should be considered when you need to protect the fragile parts of the circuit assembly from shock, vibration, or corrosive or damp environments,” said Russell Steiner, chair of the 5-33g Low Pressure Molding Task Group that published the standard. “In high vibration environments, the mechanical adhesion and resonance dampening properties of LPM materials mitigate the force seen on component bodies and lead attachment. Because mold tooling is reusable, there is a significant cost savings when using LPM.”
IPC-7621 is intended to provide insight to the possible uses for LPM, covering terminology associated with the LPM process in relation to electronic board assembly.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Precision PCB Acquires Assets of Microplace
10/13/2025 | Precision Technologies Inc.Precision Technologies Inc., doing business as Precision PCB, a One-Stop PCB Fabrication and Assembly services company with 27 years of experience providing Quality, Reliability and Excellence in customer service, has acquired the assets of Microplace, Inc.
ZenaTech Advances Taiwan Facility to Commissioning for NDAA-Compliant Drone Component Production
10/08/2025 | Globe NewswireZenaTech, Inc., a business technology solution provider specializing in AI (Artificial Intelligence) drones, Drone as a Service (DaaS), Enterprise SaaS, and Quantum Computing solutions, announces that its Taipei, Taiwan-based Spider Vision Sensors (SVS) subsidiary has advanced to the commissioning phase and assembly line setup at its recently leased 16,000 square-foot drone components manufacturing facility.
Dymax's New 9773 Ruggedized Adhesive Meets NASA ASTM E595 Low Outgassing
10/07/2025 | DymaxDymax, a leading manufacturer of rapid and light-curing materials and equipment, is pleased to add 9773 ruggedizing and staking adhesive to its portfolio of materials designed for coating, protecting, and securing components on printed circuit boards in satellites, missiles, and space applications.
UST, Kaynes Semicon Partner to Set Up Rs 3,330 Crore Joint Venture for Semiconductor Manufacturing in India
09/30/2025 | PRNewswireUST, a leading AI and technology transformation solutions company, has announced a strategic investment in Kaynes Semicon, a prominent Indian semiconductor manufacturer.
Indium Expert to Present on Solder Paste Solutions at SMTA Empire Expo and Tech Forum
09/29/2025 | Indium CorporationIndium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation on solder paste best practices at the SMTA Empire Expo and Tech Forum, to be held October 1 in East Syracuse, New York.