-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
IPC Publishes Standard on Low-Pressure Molding for Circuitry Encapsulation
March 19, 2018 | IPCEstimated reading time: 1 minute
IPC announces a new standard, IPC-7621, Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics, a guidance document that offers instruction on using Low Pressure Molding (LPM) in place of potting for circuitry encapsulation.
Unlike potting, where the potting vessel becomes the outer “shell” of the encapsulated part, LPM utilizes mold tooling which is removable and re-useable. LPM also creates a physical layer, providing mechanical and environmental protection for handling and mounting the component device.
Typically, potting vessels are filled with potting compound which hardens in the vessel, causing the vessel to become part of the potted assembly. LPM requires no such vessel and can be molded into a desired form. LPM is commonly done with polyamide (PA) polymer, a thermoplastic, that is brought to liquid state, encapsulating electronic assemblies into a desired form or shape. After the material has cooled, a thick plastic layer remains, working as a protective, sealed barrier. This layer protects the board and components from the environment.
“LPM should be considered when you need to protect the fragile parts of the circuit assembly from shock, vibration, or corrosive or damp environments,” said Russell Steiner, chair of the 5-33g Low Pressure Molding Task Group that published the standard. “In high vibration environments, the mechanical adhesion and resonance dampening properties of LPM materials mitigate the force seen on component bodies and lead attachment. Because mold tooling is reusable, there is a significant cost savings when using LPM.”
IPC-7621 is intended to provide insight to the possible uses for LPM, covering terminology associated with the LPM process in relation to electronic board assembly.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
ITW EAE to Showcase Latest Electronic Assembly Equipment Developments at productronica
10/21/2025 | ITWITW EAE will be showcasing its latest developments at productronica, November 18-21 in Munich, Germany. The ITW EAE booth A4–554 will have MPM, Camalot, Electrovert, Vitronics Soltec and Despatch applications experts on hand as well as sales and management to answer questions and offer solutions.
FCT Leverages Flex Design and Total Build Solutions to Drive Innovation
10/22/2025 | Marcy LaRont, PCB007 MagazineWhat’s hot in flexible circuits right now? At PCB West, I spoke with Ben Savage, business development manager at Flexible Circuit Technologies (FCT), about their flex design services and end-markets where FCT sees the most flex activity. We also discussed the company’s focus on providing supply chain resiliency, as well as the constant search for new flex engineers. If you’re looking for a new opportunity in flexible circuits, FCT is hiring.
PCBA Market Poised to Reach $147.5 Billion by 2035
10/20/2025 | Globe NewswireGlobal printed circuit board assembly market is projected to reach $147.5 billion by 2035, at a CAGR of 4.7% during the forecast period 2025-2035
Precision PCB Acquires Assets of Microplace
10/13/2025 | Precision Technologies Inc.Precision Technologies Inc., doing business as Precision PCB, a One-Stop PCB Fabrication and Assembly services company with 27 years of experience providing Quality, Reliability and Excellence in customer service, has acquired the assets of Microplace, Inc.
ZenaTech Advances Taiwan Facility to Commissioning for NDAA-Compliant Drone Component Production
10/08/2025 | Globe NewswireZenaTech, Inc., a business technology solution provider specializing in AI (Artificial Intelligence) drones, Drone as a Service (DaaS), Enterprise SaaS, and Quantum Computing solutions, announces that its Taipei, Taiwan-based Spider Vision Sensors (SVS) subsidiary has advanced to the commissioning phase and assembly line setup at its recently leased 16,000 square-foot drone components manufacturing facility.