-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
The Latest in Automation
When customer requirements shift, responses range from new equipment to automation. Explore the newest solutions reshaping production and how today’s market dynamics are driving these trends.
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Indium’s Vareha-Walsh to Present at Minor Metals Trade Association Event
March 20, 2018 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, will share her perspective on indium supply and demand at the Minor Metals Trade Association (MMTA) International Minor Metals Conference 2018 event on April 11-13, in Montreal, Canada.
Vareha-Walsh’s presentation, Indium Supply and Demand Overview, will review the multiple events that can trigger price increases or decreases within the market. Vareha-Walsh will also provide insight into growth expected in the flat-panel display industry.
Vareha-Walsh is responsible for sourcing of critical raw materials such as indium, gallium, germanium, tin, silver, and other products and services that support Indium Corporation’s manufacturing operations, as well as the trading of metals and sales of reclaim services for Indium Corporation’s Korean operation. She has more than 15 years of metals market experience from numerous roles and responsibilities, including Director of Global Procurement for a global premium alloy company, and Director of Metallurgical Operations and Procurement for a global tungsten-based business. She also has experience in finance as a Business Unit Controller, sales expertise as Director of Sales and New Business Development Manager, and has participated in metals recycling and scrap/reclaim markets. Vareha-Walsh earned a bachelor’s degree in finance from Duquesne University and an MBA from the University of Pittsburgh. She is a Certified Public Accountant (CPA), holds certificates in leadership development and manufacturing excellence, and has a Lean Green Belt.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, click here.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Real Time with... productronica 2025: Navigating Changes in the EMEA Market—Insights from Ventec Experts
12/10/2025 | Real Time with...productronicaVentec's Mark Goodwin and Pesh Patel explore the EMEA market's structural changes, including Panasonic's factory closure and its effects on laminators. They discuss the transition to low DK glass and the influence of the AI boom. Mark highlights the need for effective inventory management, while Pesh presents the glass-free revolution, showcasing new materials and resin technologies that improve performance and expand applications beyond traditional circuit boards.
Indium Expert to Tackle Reliability Challenges in AI and High-Performance Computing at EPTC 2025
11/27/2025 | Indium CorporationIndium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025). The conference will be held December 2-5, 2025, in Singapore.
Connect the Dots: The Future of Designing for Reality—Electroless Copper
11/26/2025 | Matt Stevenson -- Column: Connect the DotsOn a recent episode of I-Connect007’s On the Line With… podcast, we discussed electroless copper deposition—depositing a thin copper layer into the through-holes and vias of what will eventually become a printed circuit board. Specifically, it is a chemically catalyzed deposition of copper, mainly to the epoxy inside the holes (as well as on the entire surface of the board). Electroless differs from electrolytic in that electrolytic deposition relies on electricity.
The Impact of the AI Boom on PCB and Raw Materials Supply Chains
11/13/2025 | Mark Goodwin, Ventec International GroupThe PCB industry is entering a period of unprecedented structural change, driven by the demands of artificial intelligence and advanced computing. What was once a cyclical market has become a capacity race. It’s one that rewards foresight, collaboration, and strategic supply partnerships. Understanding these dynamics is essential for maintaining stability and growth across all market segments. This report, created by Ventec International Group, provides a clear view of how AI-driven demand is reshaping the PCB materials landscape and what actions are required to secure long-term supply.
UHDI Fundamentals: An Overview of UHDI Substrate Materials and Vias
11/13/2025 | Anaya Vardya, American Standard CircuitsThe rapid proliferation of 5G/6G communications, Internet of Things (IoT), high-performance computing (HPC), AI, and medical electronics has driven the need for increasingly compact, high-performance circuit packaging. UHDI, defined by feature sizes well below traditional HDI, addresses these demands by enabling ultra-fine lines, dense via interconnects, and embedded passive functionality. Understanding the materials and layering strategies in UHDI is essential for advancing both manufacturing and application design