-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Kyzen’s Bixenman to Present at Electronics in Harsh Environments Conference
March 21, 2018 | KyzenEstimated reading time: 1 minute
KYZEN has announced that Dr. Mike Bixenman will present at the SMTA Electronics in Harsh Environments Conference, scheduled to take place April 24-26, 2018 at the Crowne Plaza Amsterdam.
The conference is focused on building reliable electronics that operate within harsh environments. Dr. Bixenman will present “Materials Characterization under Leadless Component Bodies,” and will discuss the results from his research to qualify and validate assembly processes as it relates to materials and cleaning using alternative test board design features to determine the risk of failure.
“This conference is a great resource for engineers of all levels,” explained Mike Bixenman. “Materials in electronics packaging continue to evolve in response to complex manufacturing and reliability requirements, particularly those that must work within aggressive operating environments.”
Experts from industry and academia will present on topics including predicting component life, solder alloys that can withstand high operating temperatures, test methods for harsh environments, electrochemical reliability and coatings. Miniaturization and environment play major roles in the electronics lifecycle. The failure mechanisms for SAC solder joints, LEDs and Electrochemical Migration will be studied and reviewed, with particular attention paid to the automotive end-use environment.
Dr. Mike Bixenman has more than 25 years of experience in the design of electronic assembly cleaning materials and process integration. He has held the position of IPC/SMTA Cleaning Symposium Chair over the last 10 years and is the current chair of the IPC Cleaning Handbook Task Group. Dr. Bixenman holds four earned degrees including a Doctorate in Business Administration.
About KYZEN
KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, click here.
Suggested Items
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.