Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
INSPECTIS AB Launches ‘All-in One’ F30 Full HD Digital Microscope
March 26, 2018 | INSPECTIS ABEstimated reading time: 1 minute
INSPECTIS AB announces the new F30 'All-in-One' Full HD Digital Microscope. New features and superb all-round performance now come together in this convenient, durable, industrial grade package. The F30 joins the popular F30s Full HD Digital Microscope, known for its adaptability and versatility.
The F30s is popular for having established a reputation as the all-around ‘best choice’ for the widest range of visual inspection applications. Now, the F30 combines all features and competitive advantages into an all-in-one system with a convenient plug-and-play format, with LED array and essential built-in controls (e.g., Zoom, Iris, Color Balance).
All basic parameters such as zoom, brightness and color levels can be controlled through on-board buttons on top of the device, and a full range of additional control features and setting memories can be accessed using the HD-020 remote control or via computer software. The F30 also features an auxiliary power socket for use with the new INSPECTIS ring light, providing excellent image quality for such structures as solder joints on PCB assemblies and highly reflective metallic parts, all with minimum glare and reflection.
F30 options include an ESD-protected housing and a built-in laser pointer. The F30 brings uncommon capabilities and advantages to digital microscopy for SMT electronics assembly inspection including Full FHD, 1080p 60 fps HDMI output for lag-free magnified working, superior 30:1 zoom optics with auto-focus, and a generous practical working distance. Objects under inspection are rendered sharp, clear, and large; its 56x screen magnification on a 24” monitor, for example, can be increased up to 200x with auxiliary lenses.
An optional built-in laser pointer aims at the area of interest and assists in quickly locating it on the screen whilst efficient object handling is aided by the full range of thoughtfully-designed accessories.
About INSPECTIS AB
INSPECTIS AB is a premier line of advanced optical inspection solutions for PCB assembly. INSPECTIS offers a line of plug and play, reliable and cost effective high definition camera microscopes designed for non- contact optical inspection, quality control, repair and rework, and more. For more information, click here.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.