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IPC K-FEST 2026 Brings AI, Manufacturing and Standards into Focus

11/06/2026 | Global Electronics Association
Organized by the Global Electronics Association with support from Korea Testing Laboratory (KTL), the fourth IPC Korea Festival of Electronics Standards and Technology (IPC K-FEST 2026) took place in Seoul on November 3.

Learning With Leo: Observations from IPC Builds in Paris

11/04/2026 | Leo Lambert -- Column: Learning With Leo
I spent a week in Paris in September at the IPC Builds meetings, and it gave me the chance to see, take part in, and document a broad range of technical and training-related discussions affecting the electronics manufacturing industry. I go to these meetings because what gets decided in those rooms ends up in the classes we teach at EPTAC. In addition to attending committee meetings, I participated in keeping minutes for several sessions because some meeting leaders were unable to attend due to travel restrictions.

From IPC Standards to Practical DFM

10/21/2026 | Marcy LaRont, I-Connect007
DFM seems like common sense: If we know the rules a PCB must meet, why not check the design against them before it ever reaches the factory? In practice, of course, it’s not quite that simple. I caught up with Susan Kayesar, product manager at Siemens and longtime contributor to Global Electronics Association standards activities, to talk about an ongoing effort between Siemens and the Association to translate IPC requirements into practical, software-based DFM checks.

Fresh PCB Concepts: Don't Let Over-specification Come Back to Haunt You

10/22/2026 | Team NCAB -- Column: Fresh PCB Concepts
In my career, I never imagined a shortage of FR-4 materials like the one we see today, a situation that has frustrated both PCB manufacturers and customers. FR-4 materials are highly substitutable when compared to exotic materials, so if a factory does not have one specific brand of FR-4, they will typically have an equivalent material in stock. This forces our customers to choose between waiting an unreasonable amount of time for the branded materials to arrive at the factory and waiting a slightly shorter time for the substituted materials.

HDP, Global Electronics Association Release New Copper Foil Profile Test Method

10/19/2026 | HDP User Group
High Density Packaging User Group (HDP) and the Global Electronics Association are pleased to announce the release of a new test method, IPC-TM-650-2.2.23, based on the results of HDP’s Non-Contact Copper Foil Profile project.