Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Alpha's Jason Fullerton Presenting at Soldering, Cleaning & Coating Workshop
April 3, 2018 | Alpha Assembly SolutionsEstimated reading time: 3 minutes
Alpha Assembly Solutions will be one of the featured presenters at a Soldering, Cleaning and Coating workship being hosted by ZESTRON on Tuesday, April 17, 2018 at the Hard Rock Casino in Vancouver, Canada.
As part of the ZESTRON Academy workshop, Alpha Customer Service Support Engineer Jason Fullerton will be presenting on the topic, "No-Clean Fluxes – Why and When They Should be Cleaned?". Fullerton will cover the IPC classifications of these fluxes, the benefits and drawbacks of no-clean fluxes to both older RMA fluxes and newer water-soluble fluxes, and the two primary drivers for cleaning no-clean fluxes.
"Fluxes often do not get the careful attention and consideration that they should," said Jason Fullerton. "This workshop is an excellent opportunity to cover the science behind and the applications for no-clean fluxes, ensuring that the best electrochemical reliability and material compatibility is achieved."
Three other speakers will present at the day-long workshop. Mike Konrad from Aqueous Technologies will present "Contaminations Associated Failure Mechanisms and How to Avoid Them", Jigar Patel from ZESTRON will cover "PCB Reliability with QFNs and No Clean Fluxes", and Kai Hui of MG Chemicals will discuss "Material Selection and Application for Ruggedization of Electronics".
ZESTRON Academy is dedicated to providing cleaning process education to the electronics manufacturing industry through customized training either on-site or at one of our seven global Technical Centers, and through webinars, workshops, and industry events. Alpha Assembly Solutions is proud to partner with ZESTRON to share the latest research, knowledge and product innovations.
For more information regarding the ZESTRON Soldering, Cleaning, and Coating Workshop, please click here.
About Zestron
ZESTRON is a worldwide integrated leading provider of high precision cleaning products and services whose mission is to innovate, educate and develop the highest quality products and services to meet our customers' needs. Throughout the world, ZESTRON offers a wide range of cleaning process solutions for high tech industries where reliability is mandatory. ZESTRON's primary focus is to offer our customers the most innovative products, services and solutions to satisfy even the most stringent precision cleaning requirements.
ZESTRON is proud to serve many of the largest OEM's in the industry and has implemented thousands of cleaning processes worldwide. Whether considering cleaning applications for SMT or Semicon Packaging products, ZESTRON's global network of application engineers are ready to provide world-class cleaning support.
For more information, please click here.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.
For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.