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Alpha to Present Low-Temp Soldering with Sn-Bi Alloys at SMTA China East Technical Conference
April 4, 2018 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will present a technical paper on “Low Temperature Soldering Using Sn-Bi Alloys” at the upcoming SMTA China South Technical Conference on April 25, 2018 in Shanghai.
Presented by William Yu, Senior Technical Services Manager for Alpha, the paper illustrates how low temperature solder alloys are preferred for the assembly of temperature-sensitive components and substrates. The alloys in this category are required to reflow between 170°C and 200°C soldering temperatures. Lower soldering temperatures result in lower thermal stresses and defects, such as warping during assembly, and permit use of lower cost substrates. Sn-Bi alloys have lower melting temperatures, but some of its performance drawbacks can be seen as deterrent for its use in electronics devices.
Therefore, the technical presentation will show that non-eutectic Sn-Bi alloys can be used to improve these properties and further align them with the electronics industry specific needs. The physical properties and drop shock performance of various alloys will be evaluated, and their results will be analysed in terms of the alloy composition, including Bi content and alloying additions.
SMTA China East Technical Conference
Date: Wednesday, April 25, 2018
Time: 10:30am -11:05am
Venue: Room No. 6, B2, Shanghai World Expo Exhibition & Convention Centre
Topic: Low Temperature Soldering Using Sn-Bi Alloys
Presented by: William Yu, Senior Technical Services Manager of Alpha Assembly Solutions
About Alpha Assembly Solutions, Inc.
Alpha Assembly Solutions, Inc., a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.
For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
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