Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
ASM Enhances Printing and Placement Platforms
April 11, 2018 | ASM Assembly SystemsEstimated reading time: Less than a minute
Designed for the highly flexible mid-speed markets, high mix and prototype productions, ASM Assembly Systems’ E by DEK and E by SIPLACE printing and placement platforms set totally new standards in terms of quality, performance and modularity. To further improve the E solutions based on customer feedback, ASM is adding new features and options to the said platforms this year.
For the E by DEK, new options such as the DEK Interchangeable Understencil Cleaner and the DEK Adjustable-Width Stencil Mount allow for more automated cleaning as well as easier and faster stencil changeover.
Meanwhile, the E by SIPLACE adds the Odd-Shape Component Package for the smart placement of large, bulky components and connectors. Additionally, the E by SIPLACE Ease of Use package makes regular tasks such as tray teaching, handling of dirty or defect nozzles, and face-down recognition of diodes much more efficient.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Secure Semiconductor Manufacturing Acquires Full SMT Line from Manncorp
09/11/2025 | ManncorpSecure Semiconductor Manufacturing, LLC (SSM), an American-owned company dedicated to producing secure printed wiring boards and advanced assembly solutions in the MidWest USA, today announced the acquisition of a complete surface mount technology (SMT) line from Manncorp.
AQUANOX A4618 and CYBERSOLV C8882 to Lead KYZEN Offerings at SMTA Long Island Expo and Tech Forum
08/27/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Long Island Expo & Tech Forum on Wednesday, Sept. 10, 2025 at the Marriott Melville Long Island.
KYZEN to Feature CYBERSOLV 141-K and KYZEN E5631J at SMTA Michigan Expo and Tech Forum
08/05/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Michigan Expo and Tech Forum, scheduled to take place Tuesday, August 19, 2025 at Laurel Manor in Livonia, Michigan. During the event, the KYZEN Clean Team will highlight precision aerosol cleaner CYBERSOLV 141-K and understencil cleaner KYZEN E5631J.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
KYZEN to Focus on Aqueous Cleaning and Stencil Cleaning at SMTA Juarez
05/20/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Juarez Expo and Tech Forum, scheduled to take place Thursday, June 5 at the Injectronics Convention Center in Ciudad Jarez, Chihuahua.