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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Amkor Technology Expands Arizona Investment to $12 Billion

09/10/2026 | Amkor Technology
Amkor Technology, Inc., a leading provider of outsourced semiconductor packaging and test services, today announced phase 2 of its Arizona Advanced packaging and test campus.

MKS to Showcase Electronics Manufacturing and Precision Laser Solutions at electronica India 2026

09/08/2026 | MKS Inc.
MKS Inc. will showcase their latest innovations for electronics manufacturing at electronica India 2026, taking place September 16–18 at the Bangalore International Exhibition Centre (BIEC) in Bengaluru, India.

MKS Highlights Laser and Chemistry Solutions at KPCA Show 2026

09/03/2026 | Atotech
MKS Inc. will showcase integrated manufacturing solutions in advanced packaging, package substrate, and printed circuit board (PCB) manufacturing at KPCA Show 2026 held at Songdo Convensia in Incheon, South Korea, from September 9–11. Visitors can meet MKS’ representatives at booth 201 in hall 3 and discover the company’s latest solutions for advanced electronics manufacturing.

Foxconn Expands U.S. AI Footprint With California Property Acquisition

08/28/2026 | I-Connect007 Editorial Team
Foxconn is expanding its U.S. presence with the acquisition of land and a manufacturing facility in Santa Clara, California, as the electronics manufacturing giant continues to invest in AI-related business.

PewCB One Desktop PCB Prototyping System

08/24/2026 | PewCB
PewCB has unveiled the PewCB One, a desktop PCB prototyping system designed to significantly accelerate hardware development. Production of the device is scheduled to begin on September 1 in Guangzhou.
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