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High Density Packaging User Group Announces European Space Agency Membership

11/04/2025 | High Density Packaging User Group
High Density Packaging User Group (HDP) is pleased to announce that the European Space Agency (ESA) has become a member.

Target Condition: Distribution of Power—Denounce the Ounce

11/05/2025 | Kelly Dack -- Column: Target Condition
Have you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.

High Density Packaging User Group Announces ASKPCB Membership

11/03/2025 | HDP User Group
High Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.

Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production

10/28/2025 | Kurt Palmer -- Column: Driving Innovation
Rigid-flex printed circuit boards are a highly effective solution for placing complex circuitry in tight, three-dimensional spaces. They are now indispensable across a range of industries, from medical devices and aerospace to advanced consumer electronics, helping designers make the most efficient use of available space. However, their unique construction—combining rigid and flexible materials—presents a fundamental challenge for PCB manufacturers.

MKS’ Atotech Showcases Next-gen PCB and Substrate Manufacturing Solutions at CPCA Plus 2025

10/24/2025 | MKS Inc.
MKS Inc., a global provider of enabling technologies that transform our world, announced its participation in CPCA Plus Show 2025, taking place October 28 – 30 at Shenzhen International Convention and Exhibition Center.
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