MKS’ Atotech Showcases Next-gen PCB and Substrate Manufacturing Solutions at CPCA Plus 2025

Estimated reading time: 2 minutes

MKS Inc., a global provider of enabling technologies that transform our world, announced its participation in CPCA Plus Show 2025, taking place October 28 – 30 at Shenzhen International Convention and Exhibition Center. Under its strategic brands Atotech® (process chemicals, equipment, software) and ESI® (laser systems), MKS will present its latest innovations for advanced printed circuit board (PCB) and package substrate manufacturing.

All visitors are warmly invited to meet MKS’ representatives at booth 6C41 and discover the future of advanced electronics manufacturing. Experts from both brands will be present to showcase the company’s latest innovations across lasers, optics, motion control, process chemistry, and advanced manufacturing equipment. These cutting-edge technologies are driving the evolution of PCB and package substrate production, and enabling breakthroughs in miniaturized and high-speed applications, empowering the evolution of AI, high-performance computing (HPC), and advanced electronics manufacturing.

Visitors will gain valuable insights into how MKS is tackling complex interconnect challenges and delivering solutions that combine precision, reliability, and scalability. From enabling next-generation devices to redefining manufacturing standards, MKS is shaping the future of electronics with unmatched expertise and innovation, and provides a platform to discuss emerging industry trends and challenges.

“MKS’ Atotech remains at the forefront of innovation and sustainability in surface-finishing technologies. Through our strong commitment to R&D, we continue to drive progress that empowers manufacturers in China and globally. Our advanced solutions are designed to meet evolving industry needs and support the dynamic growth of China’s manufacturing sector,” said Dr. James Tsai, Business Director of Greater China.

Chemistry show highlights include:

• Printoganth® P2: Most capable horizontal electroless Cu process for excellent throw into BMVs and nano-void free deposits suitable for advanced dielectric materials (5G, FPCB, etc.)
• Cupraganth® MV: Next-generation palladium-free e’less copper activation for package substrates
• InPulse® 2HT2: Enables reliable conformal copper plating across substrates with varying hole densities, ensuring effective wetting and plating of blind micro vias and through via
• Cuprapulse® IN: Reverse pulse plating with insoluble anodes for HDI, MLB, and ICs
• NovaBond® PX-S2: Advanced bonding enhancement for high-speed signal transmission
• EcoFlash® S300U: Iron sulfate-based differential etchant that increases yield and lowers cost by preventing undercuts, maintaining circuit integrity, and reducing roughness while allowing easy iron regeneration with hydrogen peroxide
• PallaBond® 2: The next-gen EPAG for high-end circuitry and reliability applications
• Stannatech® 2100: New optimized immersion tin process of the Stannatech evolution

Our equipment highlights for PCB production are:

• vPlate®: Gold standard for vertical conveyor plating equipment for next-generation HDI PCB and package substrates
• New Uniplate®: The industry-leading horizontal plating tool for next-generation HDI PCBs and package substrate manufacturing
• Stannatech Line®: New GEN Immersion Tin Line for high volume production requirements
• PLB Line®: Excellent BMV capability enabling HDI PCB production

On the laser equipment side, promotions include:

• Geode™ platform solutions: Next generation PCB and advanced substrate CO2 and UV laser via drills
• Geode™ G2 PCB laser drill: Next generation CO2 via drilling for HDI and integrated circuit packaging manufacturing – built to drill the ultimate via
• CapStone™ Flex PCB laser drill: Breakthrough productivity – Increase throughput up to 2x and reduce overall processing costs by 30%

Event: CPCA Plus 2025
Date: October 28-30, 2025
Booth: 6C41
Venue: Shenzhen International Convention and Exhibition Center