-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
IMI German Subsidiary VIA Optronics Forms JV with Toppan
April 12, 2018 | Integrated Micro-Electronics Inc.Estimated reading time: 3 minutes
Integrated Micro-Electronics Inc. (IMI)’s German subsidiary VIA Optronics GmbH recently formed a new joint venture company with Toppan Printing Co. Ltd in Japan to serve the market for copper-based metal mesh touch sensors by transferring 65% of the shares of Toppan Touch Panel Products Co. Ltd, a newly formed spin-off from Toppan, to VIA. The name of the new joint venture company will be VTS-Touchsensor Co. Ltd (VTS).
To be based in Higashiomi, Shiga Prefecture, in Japan, VTS will develop and manufacture the metal mesh touch sensors in Japan on the existing premises of Toppan. VIA will leverage its years of knowledge and experience of market requirements, system-level design, and production in the automotive, consumer and industrial markets to support further development of the core sensor technology.
Juergen Eichner, CEO of VIA Optronics, said, “Using the experience of both companies, VTS will provide game changing metal mesh touch sensors to their existing and future customer base. The new setup will also strengthen VIA’s portfolio of differentiated and value-added sensor technology for touch panels, touch-display modules, display head assemblies, and interactive display systems across multiple markets and segments.”
VIA, together with Toppan, will continue to grow the business in all market segments, extend touch sensor production line capacity of VTS and continuously develop the technology itself.
VIA will own 65% of the JV, while Toppan, 35%.
About VIA
VIA is a leading supplier of interactive display solutions, with core competences in the area of optical bonding for sunlight readability and robustness as well as high-performing touch-display modules. Having its roots in the high-reliability and industrial market segments, the company now serves multiple touch-display applications in consumer electronics, automotive and industrial markets.
VIA’s optical bonding technology enables high yield bonding for multiple display application such as thin, lightweight, curved, plastic lens, 3D and large size applications. Now in combination with superior copper-based metal mesh touch technology, VIA is in a strong position to address the growing demand for interactive display solutions in consumer electronics, automotive and industrial display applications.
About Toppan
Toppan Printing Co., Ltd. is one of the largest Japanese and worldwide printing companies, having businesses in the area of commercial printing, publications, packaging, interior decor and industrial materials, clothing, precision electronic components, securities and business forms, compact discs, and computer processing. The Company operates through three segments: Information & Communication, Living & Industry, and Electronics.
As part of the Electronics segment, Toppan has developed and marketed projected capacitive touch sensors using copper-based metal mesh with low sheet resistance that achieve excellent touch performance and optical quality, and has developed display-related business operations based on these sensors.
About IMI
Integrated Micro-Electronics Inc. (IMI), the manufacturing portfolio of AC Industrial Technology Holdings, Inc., a wholly-owned subsidiary of Ayala Corporation is among the leading global manufacturing solutions providers in the world. IMI ranks 18th in the list of top 50 EMS providers in the world by the Manufacturing Market Insider (March 2018 edition), based on 2017 revenues. In the automotive segment, it is the sixth largest EMS provider in the world per New Venture Research.
IMI specializes in highly reliable and quality electronics for long product life cycle segments such as automotive and industrial electronics.
For the automotive segment, IMI delivers customized solutions for safety and security, among others. It supplies cameras that are integral technology to the advanced driver assistance systems (ADAS). For the industrial segment, it manufactures security and access control devices, power modules, and building automation, among others. From its manufacturing plants in the United States, Mexico, Bulgaria, Czech Republic, Germany, China, United Kingdom and the Philippines, IMI provides engineering, manufacturing, and support and fulfillment capabilities to diverse industries globally. For more information, visit www.global-imi.com.
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.