-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Vi TECHNOLOGY to Showcase the Most Innovative SPI Product Since the Introduction of Moiré Systems
April 19, 2018 | Vi TECHNOLOGYEstimated reading time: 1 minute
Vi TECHNOLOGY, a provider of 3D inspection solutions for PCB assembly and a member of Mycronic Group, today announced that it will exhibit with its representative at the S.E.E. Scandinavian Electronic Event, scheduled to take place April 24-26, 2018 at the Kista Expo Center in Sweden. Wretom will showcase the PI Series 3D SPI in Booth C02:30.
The PI Series offers the only inspection systems that program automatically. The series has been recognized by the industry as the most innovative SPI product since the introduction of Moiré systems.
The awarded PI Series 3D SPI offers new horizons with programming-free software and unprecedented accuracy for small pads. With 360° digital Moiré technology, the PI Series offers a unique extra-large 3D image for unprecedented review interface and outstanding accuracy.
About Vi TECHNOLOGY
Vi TECHNOLOGY is a global designer, manufacturer and supplier of a wide range of innovative inspection equipment and software solutions for PCB assembly. Vi TECHNOLOGY serves very demanding market segments including telecoms, consumer, computer, automotive, infrastructure, industrial and medical.
Vi TECHNOLOGY is a member of the Mycronic Group. Mycronic AB is a leading and innovative global high-tech company developing and manufacturing a range of high-precision production equipment and advanced software for the electronics industry.
For more information, click here.
Suggested Items
Technica Installs CBT/MLI Direct Imaging System at Summit Interconnect Santa Clara
01/14/2025 | Technica USATechnica has recently installed the 6th CBT/MLI Direct Imaging (DI) system at Summit Interconnect's Santa Clara operation, a testament to Summit's ongoing commitment to cutting-edge technology and operational excellence.
Merlin Circuit Technology Achieves Prestigious JOSCAR Accreditation
01/14/2025 | Merlin Circuit TechnologyMerlin Circuit Technology is proud to announce it has been awarded the coveted Joint Approvals Group for Industry (JAG) Standard 001 (JOSCAR) accreditation.
SK Telecom, SK hynix and Penguin Solutions Sign Collaboration Agreement for AI Data Center Solutions
01/14/2025 | SK TelecomSK Telecom announced that it has signed a collaboration agreement with SK hynix and Penguin Solutions to pursue joint research, development, and business promotion of artificial intelligence data center (AIDC) solutions.
Oshkosh Defense Advances Next-Gen Autonomous Technology for ROGUE-Fires
01/13/2025 | BUSINESS WIREOshkosh Defense LLC, an Oshkosh Corporation business, was awarded a $29.9 million contract modification to integrate next-generation autonomous technology into the Remotely Operated Ground Unit for Expeditionary Fires (ROGUE-Fires) with deliveries beginning in 2025.
Happy’s Tech Talk #36: The LEGO Principle of Optical Assembly
01/14/2025 | Happy Holden -- Column: Happy’s Tech TalkDr. Steven Case of Avanti Optics Corporation once advocated a new approach to photonic assembly, based on the LEGO principle. He compared today’s erbium-doped fiber amplifier (EDFA) technology to the crude point-to-point wiring of early model circuit boards, which gave way to modern circuit boards that could be considered prefabricated interconnects.