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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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Letter from the Editor: Dawn of a New Flex007 Platform
April 19, 2018 | Andy ShaughnessyEstimated reading time: Less than a minute

Due to an increased demand for flex content, I-Connect007 has decided to create a new quarterly Flex007 Magazine to better serve our readers. We are excited to launch this publication on April 23, 2018. Thus, today we will be sending out the last edition of our flex newsletter. Thanks for all of your support.
The Flex007 Magazine will focus on the flex and rigid-flex circuit markets with information to serve flex system designers, electrical engineers, flex PCB designers, and anyone responsible for integrating flex into their products at the OEM/CEM level. Flex developers will now have access to a publication that is dedicated to assisting them with their technical needs, along with their market and supply chain challenges.
We look forward to continuing to provide you with original, relevant content related to flex and rigid-flex circuits. To subscribe to Flex007 Magazine, click here. You will also find the latest news about flex and rigid-flex circuits incorporated into our Daily News newsletters in the future.
Sincerely,
Andy Shaughnessy
Flex007 Magazine
Suggested Items
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
Gorilla Circuits Elevates PCB Precision with Schmoll’s Optiflex II Alignment System
06/23/2025 | Schmoll MaschinenGorilla Circuits, a leading PCB manufacturer based in Silicon Valley, has enhanced its production capabilities with the addition of Schmoll Maschinen’s Optiflex II Post-Etch Punch system—bringing a new level of precision to multilayer board fabrication.
All Flex Solutions Upgrades Lamination Layup
06/22/2025 | All Flex SolutionsAll Flex Solutions has invested in Ulrich Rotte lamination layup stations in their rigid flex layup area. The Ulrich Rotte stations automate the layup process by handling the lamination plates, which are heavy, and sequencing the layup process for the operators.
SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics
06/18/2025 | SEMIFlexTech, a SEMI Technology Community, today issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing.
Flex CEO Sees US Manufacturing Resurgence
06/18/2025 | I-Connect007In a June 16 interview on Bloomberg Open Interest, Flex CEO Revathi Advaithi said the supply chain is already shifting, with more goods now being manufactured in the U.S.