Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
SMTA Europe: Electronics in Harsh Environments Conference, Session 7
April 20, 2018 | SMTAEstimated reading time: 1 minute
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25, 2018.
The demand for electro-mobility technologies and solutions within the automotive industry has rapidly increased with the emergence of electric and autonomous vehicles. These applications expose the electronics to higher voltages. Kerstin Lux, a Ph.D. candidate from Bosch, will present on humidity induced failure mechanisms on electronics during high voltage load. Ms. Lux will present research that investigated the behavior of PCBs built with different material sets under high-voltage and high humidity load conditions. A model of the electrochemical reactions under high voltage and humidity conditions will be presented.
High power LED and automotive electronics must endure high temperature, thermal stresses, vibration and other harsh conditions. Dr. Maalekian of AIM Solder will present on improved solder alloy reliability and mechanical stability using micro-applying elements. The research from this work find that the addition of micro alloying dopants reduce the alloys temperature gradient’s while improving thermal fatigue and reliability.
When exposed to high temperatures stresses, there is the potential for solder alloy cracking and delamination. Graham Wilson of Indium Corporation will present on solder printed over a metal mesh preform to increase the reliability between the substrate and baseplate within IGBT Modules. The research finds that increased standoff improves the homogenous solder layer. Mr. Wilson will present research findings that improve solder reliability and overcome thermal fatigue and solder delamination.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.