Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Inventec Performance Chemicals Upgrades Solder Powder Facilities
May 10, 2018 | Inventec Performance ChemicalsEstimated reading time: 2 minutes
Inventec Performance Chemicals USA LLC, producer of Inventec solder pastes, cleaning chemistries and Amtech branded solder products, has completed major production and laboratory upgrades to its solder powder making plant thanks to the support of the State of CT Department of Economic and Community Development and the Connecticut Center for Advanced Technology.
“Our partnership with the state of Connecticut has been instrumental to our ability to innovate for growth,” says David Reitz, Managing Director and CEO of Inventec Performance Chemicals USA LLC; “The upgrades to our facility has positioned us not only to expand our business with current customers but also to develop next generation products that continue to position us – and our costumers to be market leaders.”
The upgraded laboratories feature the latest in particle sizing and chemical analysis. The company’s new particle sizing equipment features state of the art image analysis and electrical resistance measurements. This allows the company to effectively and accurately perform distribution analysis ranging from 1-200 microns and encompasses solder powders from Type 1 through Type 8.
Chemical analysis of metals and alloys have also been upgraded through the acquisition of the latest in Spark OES technology. This technology allows the company to perform accurate analysis of all the latest alloys, including high-reliability alloys that contain various dopants. In addition to high-reliability applications, the company will be able to perform wave pot analysis for its customers with best-in-class reliability.
Key investments into production upgrades, has increased Inventec’s capacity and output for Type 3, 4 and 5 solder powders; “We take seriously the need to continue to deliver best-in-class capabilities for our customers. New sizing equipment and upgraded environmental controls will allow the company to double production while improving the stability of the powder in various fluxes -- leading to improved soldering and voiding properties.” says Michael Gesick, Global Metals Technology Manager for Inventec Performance Chemicals.
About Inventec Performance Chemicals USA LLC
For over 40 years, INVENTEC has been serving industrial markets with sustainable products and processes that reduce the total cost of ownership, delivering:
- Innovative solutions that feature uncompromising performance
- Environmental and health protection by substituting safer products for hazardous substances ahead of regulatory standards, and by developing intelligent risk management solutions for non-substitutable hazardous substances.
- Proximity of experts in more that 20 countries who provide expert consultation, resulting in optimized solutions that serve the total needs of our customers.
Inventec has 10 subsidiaries throughout Europe, Asia, USA and Mexico, including 7 production sites that are all ISO 9001 certified and equipped with state-of-the-art laboratories.
In 2014, Inventec expanded their presence across North America by adding AMTECH solder pastes, solder powders, and process support products, providing a highly complementary addition to the full line of INVENTEC products for the electronic assembly marketplace.
For more information, click here.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.