The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
Smart Automation: AI—Revolutionizing Inspection in Electronics Manufacturing
Standard of Excellence: The Role of Technology in Enhancing the Customer Experience
Koh Young Supports Hermes Standard Meeting at NEPCON China 2018
May 10, 2018 | Koh Young TechnologyEstimated reading time: 2 minutes
Koh Young Technology, the leading 3D measurement inspection solutions provider, attended the 3rd Hermes Standard (THS) initiative meeting in Shanghai, China on April 23. The meeting, comprised of 31 SMT equipment suppliers, including 11 new participants, focused on many critical topics like field testing, synergy with the IPC CFX (Connected Factory Exchange), and further protocol development. As the founding member of this initiative, Koh Young has been moving forward with an ambitious implementation schedule to ensure THS version 1.0 could be deployed within just nine months of the first iteration.
The Hermes Standard is an open, non-proprietary standard for vendor-independent, machine-to-machine (M2M) communication. The TCP/IP- and XML-based protocol allows for simplified connectivity. Circuit boards pass through the entire production line with full traceability and data integrity, while eliminating repetitive barcode scanning at each station. The standard is completely open and free for SMT equipment supplier implementation.
Launched in March 2017, the initial Hermes Standard quickly gained market recognition among leading SMT players. The first project at Productronica 2017 was enormous success as proven by the number of companies expressing interest in the standard. Moreover, the open protocol was honored with the Global SMT Award in the category of “Software - Process Control.”
The Hermes Standard is expected to create synergy across platforms, especially when combined with the Koh Young’s KSMART solution for smart factories. Guided in part by Industry 4.0, the KSMART solution opens the door for the move to M2M communication and process optimization. For example, the KSMART Process Optimizer (KPO) allows the Koh Young SPI to automatically adjust the print process parameters by exercising complex machine-learning algorithms based on inspection and measurement feedback. The future expectation is for THS to underpin a comprehensive smart factory solution that can analyze and optimize process parameters across the entire SMT line.
“Connectivity is one of the defining characteristics of the smart factory. Different equipment vendors from the industry must come together to provide a digitally integrated process for the entire production floor. This is where The Hermes Standard comes into action. THS will help us realize a Smart Factory,” said Harald Eppinger, Managing Director of Koh Young Europe GmbH.
More details and information about The Hermes Standard can be found at the website.
About Koh Young Technology, Inc.
Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to its corporate headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, China, and the United States. These local facilities ensure it maintains close communications with its growing customers base, while providing them with access to a global network of process experts.
Share on:
Suggested Items
Living His Dream: IPC EAO Course Leads Thejas K to Role as Quality Engineer
05/30/2025 | Michelle Te, IPC CommunityIt’s not often that a child wants to follow in the footsteps of their parents’ career. But Thejas K, a 22-year-old from Mysuru, India, whose mother Padmavathi was an EMS operator for nearly 20 years, is now an associate engineer in the quality department at Cyient DLM where PCB assemblies are manufactured for aerospace and defense.
Standards: The Roadmap for Your Ideal Data Package
05/29/2025 | Andy Shaughnessy, Design007 MagazineIn this interview, IPC design instructor Kris Moyer explains how standards can help you ensure that your data package has all the information your fabricator and assembler need to build your board the way you designed it, allowing them to use their expertise. As Kris says, even with IPC standards, there’s still an art to conveying the right information in your documentation.
IPC Applauds Leadership of Reps. Moore and Krishnamoorthi on PCB Manufacturing Bill
05/28/2025 | IPCIPC, the global electronics association serving more than 1,400 U.S. companies and over 3,200 worldwide, strongly supports the bipartisan reintroduction on May 28 of the Protecting Circuit Boards and Substrates (PCBS) Act in the 119th Congress.
AT&S Strengthens European Research at IPCEI Day
05/26/2025 | AT&SWith the IPCEI program, the European Union supports companies that make important contributions to the technological development of key industries on the old continent.
LSI ADL Technology Leverages IPC Membership for Growth, Training, and Industry Leadership
05/28/2025 | Michelle Te, IPC CommunityWhether attending the EMS Leadership Summit at IPC APEX EXPO, or subscribing to workforce training, LSI ADL Technology has noted several positive changes directly related to its IPC membership. “Collaboration, brainstorming, and sharing best practices have been the most important aspects of our partnership with IPC,” says Jonathan Verity, assistant general manager at LSI ADL Technology.