American Made Advocacy: Smart Policies Can Ensure AI Data Centers Are Secure
Beyond the Board: Early Engagement Means Faster Prototyping for Defense Programs
Defense Speak Interpreted: The Autonomous Plane Battle—Skyborg Vs. Loyal Wingman
Ventec Launches Dk 3.48 Ceramic-Filled Hydrocarbon Thermoset Material
May 15, 2018 | Ventec International Group Co., Ltd.Estimated reading time: 1 minute
Ventec International Group Co., Ltd. has added to its extensive signal integrity laminate and prepreg range with the launch of tec-speed 20.0, a ceramic-filled hydrocarbon thermoset material designed for high frequency applications. tec-speed 20.0 combines unrivalled high-frequency performance (Dk 3.48 / Df 0.0037), superior loss characteristics and the highest reliability with fast availability and efficient delivery through Ventec’s fully controlled and managed global supply chain and technical support-network.
No More Compromises - Performance, Price and Availability
The tec-speed 20.0 (VT-870) is designed for the world's most demanding high frequency Printed Circuit Board applications such as cellular base station antennas, power amplifiers, LNB for broadcast satellites, automotive radar and RFID. With tec-speed 20.0, Ventec has responded to customer demands for a high-performance, reliable and cost-efficient high frequency material that also has a fast and efficient global delivery promise and dependable technical support.
The tec-speed 20.0 is a high-frequency laminate designed to preserve signal integrity up to high-GHz frequencies and has extremely low 3.48 dielectric constant (Dk) and 0.0037 dissipation factor (Df). By minimizing insertion losses, tec-speed 20.0 provides greater freedom to optimize copper trace widths, spacing, and PCB thickness.
Tested according to IPC-TM-650 specifications, the industry’s gold standard, tec-speed 20.0 is UL approved, reliable and durable, offering outstanding thermal performance. High glass transition temperature (Tg), high peel strength, and low CTE ensure structural integrity and reliability, in process and hardworking applications.
Now, tec-speed 20.0 is available as laminate or prepreg (VT-870PP), as standard with HTE copper foil or with HVLP (Hyper Very Low Profile) foil to attenuate passive intermodulation (PIM) effects.
The tec-speed 20.0 ceramic-filled hydrocarbon thermoset material is manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, ISO/TS16949 and ISO 9001:2015, and, like all Ventec products, is backed by a fully controlled and managed global supply chain, sales- and support-network.
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here.
Visit I-007eBooks to download your copy of Ventec International's micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Nolan’s Notes: Tariffs, Technologies, and Optimization
10/01/2025 | Nolan Johnson -- Column: Nolan's NotesLast month, SMT007 Magazine spotlighted India, and boy, did we pick a good time to do so. Tariff and trade news involving India was breaking like a storm surge. The U.S. tariffs shifted India from one of the most favorable trade agreements to the least favorable. Electronics continue to be exempt for the time being, but lest you think that we’re free and clear because we manufacture electronics, steel and aluminum are specifically called out at the 50% tariff levels.
MacDermid Alpha & Graphic PLC Lead UK’s First Horizontal Electroless Copper Installation
09/30/2025 | MacDermid Alpha & Graphic PLCMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to support Graphic PLC, a Somacis company, with the installation of the first horizontal electroless copper metallization process in the UK.