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Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024

11/18/2024 | Indium Corporation
Indium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.

Semiconductor Industry Experts to Present Solutions to Boost Performance at Advanced Packaging Summit in Korea

08/21/2024 | SEMI
With innovations in advanced packaging crucial to enhancing semiconductors for AI, high-performance computing (HPC) and other leading-edge applications, the Advanced Packaging Summit 2024 will gather industry visionaries on September 11 at the Suwon Convention Center to present packaging technology roadmaps and discuss solutions to performance challenges.

Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems

04/25/2024 | PRNewswire
Ansys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.

Nordson Test & Inspection Systems Demonstrates Inspection and Metrology Systems at SMTConnect 2023

05/09/2023 | Nordson Test & Inspection Systems
Nordson Test & Inspection Systems announced that it will exhibit at SMTConnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany.

TriLite Honored with SPIE Prism Award Win for Ultra-compact AR Display

02/03/2023 | TriLite
TriLite announces that its Trixel® 3, the world's smallest projection display, has been chosen by SPIE, the international society for optics and photonics, as a winner at its 2023 Prism Awards.
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