Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Balver Zinn Group to Exhibit a Host of Solder Materials at SMT Hybrid Packaging 2018
May 29, 2018 | Balver Zinn GroupEstimated reading time: 1 minute
The Balver Zinn Group announces that it will exhibit in Hall 4, Booth #231 at SMT Hybrid Packaging scheduled to take place June 5-7 in Nuremberg, Germany. The Balver Zinn Group will highlight the company’s latest products, technologies and services.
The Balver Zinn Group introduces 390-RX-HT+ a VOC flux with an organic activation system. The 390-RX-HT+ is a high reliability No-Clean flux for various soldering applications classified as ORL0 according IPC J-STD-004. This flux with high SIR values offers superior wetting performance with clear and dry residues.
Among the innovative technologies at the show will be Cobar’s extensive range of wave soldering and selective soldering fluxes:
- 94-SEL a high reliability Low-VOC selective soldering flux shows excellent soldering performance and is qualified by high-tech and automotive companies in the electronics industry
- 385-SEL a high-reliability selective flux designed specifically for selective soldering processes with short pre-heat and is besides that ideal for touch up applications
- 95-RXN-M is a Low-VOC flux with a low solid content designed to eliminate solder balling and leaves a very low level of shiny, dry residues, preferable application in Nitrogen tunnel machine
- 396-DRX-M+ is a VOC-free environmental friendly flux that exhibits powerful soldering performance combined with extremely low residues
Balver Zinn is a pioneer in lead free solders and as exclusive licensee we present Nihon Superiors new patented SN100CV lead-free micro-alloyed solder. The industry standard SN100C® has been improved by the addition of bismuth which has positive effects on the reliability of the solder joints. The SN100CV® alloy offers high reliable solder joints which are recommended for high-end and automotive electronics.
The upcoming SMT trade show in Nuremberg is the German platform to discover Cobar’s wide range of lead-free and leaded solder paste alloys including low melting solder paste formulations.
About Balver Zinn Group
Headquartered in Germany, the Balver Zinn Group has facilities in the United States, Europe and distributors in all major areas of the world. Balver Zinn – Cobar product range includes: solder bar, solder wire, solder flux, gel flux, cleaner, solder paste and miscellaneous service and soldering products. For information about the company’s complete range of solder materials, click here.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.