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Northrop Grumman Deepens Defense Collaboration in Central and Eastern Europe

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Northrop Grumman is expanding its presence in Central and Eastern Europe with new memorandums of agreement (MOUs) designed to provide NATO allies with advanced, modernized defense capabilities.

Cadence PCIe 6.0 Subsystem Achieves First-Pass Compliance

09/02/2026 | Cadence Design Systems
Cadence announced that its PHY and controller IP for the PCI Express® (PCIe®) 6.0 specification, implemented in the TSMC N3 process, achieved first-pass success at the recent PCI-SIG® compliance workshop held in late July.

ITAR vs. EAR: When PCB Fabrication Can Move Outside the U.S.

08/31/2026 | Ryan O'Connor, SOMACIS
The difference between ITAR and EAR is often reduced to a simple rule of thumb: ITAR programs must stay in the U.S. (exceptions apply), while EAR programs can be built anywhere. In practice, that distinction is incomplete and often leads to sourcing decisions that introduce compliance risk rather than reducing it. Whether a PCB can be fabricated outside the United States depends not just on whether it is ITAR- or EAR-controlled, but on how the program is classified, what data is involved, who can access it, and how fabrication is executed across locations.

GigaDevice Expands EMEA and Southeast Asia Reach with Rutronik Partnership

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BTU International Launches Aurora Vacuum Reflow Oven for High-Volume Manufacturing

08/26/2026 | BTU International, Inc.
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announced the launch of the Aurora Vacuum™ Reflow Oven, a next-generation vacuum reflow platform engineered to deliver exceptional solder quality, maximum throughput, and higher manufacturing yields for advanced electronic assemblies.
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