Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
DDM Novastar Welcomes New Director of Engineering
June 13, 2018 | DDM Novastar Inc.Estimated reading time: 1 minute
DDM Novastar is pleased to announce the return of Brian Osterhout as DDM Novastar's director of engineering.
Osterhout has over 30 years of machine design experience, with a broad background in product development and manufacturing. From 2005 to 2010, he worked as Senior Designer & Project Engineer for APS Novastar (DDM Novastar’s previous entity) and helped design the firm’s L Series Pick & Place machine, along with enhancements to the reflow oven and Stencil Printer product lines. From 2010 to the present, Brian continued to expand his knowledge base, working for a Philadelphia manufacturer specializing in fluid-film bearings. This added to his diverse background in fabrication and machining.
Osterhout will help lead DDM Novastar's engineering team in new product design and development, along with providing engineering support for the company's existing product line of pick and place machines, stencil printers, reflow ovens and related equipment. Two priorities on his radar are an AOI (PCB Optical Inspection system) and the development of a new Selective Solder System.
In additional to his CAD skills, Brian enjoys all things mechanical, and is in the process of returning a 1964 Porsche to the road. He lives in Marlton, NJ with his wife, Susie and their two children.
Brian’s return brings an exciting opportunity to DDM Novastar and strengthens our position in the SMT market.
About DDM Novastar, Inc.
With over 26,000 SMT and PCB assembly systems sold, DDM Novastar is a leading USA manufacturer of OEM equipment for the short to medium run production environment. Since our introduction of the first Through Hole Lead-forming and Component Counter products in 1982, DDM Novastar has remained an industry leading innovator. By offering our customers the most reliable, easy-to-operate, easy-to-service, and lowest total cost of ownership “turn-key” SMT OEM systems available today, our commitment is to be your primary source for the most comprehensive range of solutions for prototyping, pilot manufacturing, and low to medium run high mix applications. DDM Novastar’s unparalleled array of stencil printers, automated pick and place, reflow and batch ovens, selective and wave solder equipment is backed by superior technical support and can accommodate the most demanding applications with absolute precision. For more information, click here.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.