American Made Advocacy: Smart Policies Can Ensure AI Data Centers Are Secure
Beyond the Board: Early Engagement Means Faster Prototyping for Defense Programs
Defense Speak Interpreted: The Autonomous Plane Battle—Skyborg Vs. Loyal Wingman
IPC Extends Fab Survey Deadline to July 13
June 22, 2018 | IPCEstimated reading time: 1 minute
IPC launched a global survey of PCB manufacturers in the electronics industry this week. This confidential survey is part of a global data collection effort for the development of IPC’s 2018 PCB Technology Trends study. The deadline for PCB fabricator survey responses is July 13.
The goal of the survey is to measure current technical capabilities of the PCB industry and the potential for expanded capabilities over the next five years. The survey covers technical capabilities, including board types, layer counts, thickness, line width and spacing, aspect ratios, I/O pitch, thermal properties, frequency, reliability, materials and finishes.
Respondents may answer the questions that relate to their type of product, focusing on one specific end-use application: automotive, communications, computers and business equipment, consumer, defense and aerospace, industrial, or medical and instrumentation.
PCB fabricator participation is crucial to the success of this project, which will provide valuable guidance to the electronics supply chain to meet the current and future needs of PCB fabricators and electronics OEMs.
A global survey of OEMs was launched earlier this month to collect data on their current technical requirements, product planning involving emerging technologies, and forecasts of PCB specifications over the next five years. Together the data on PCB capabilities and OEM specifications will produce detailed aggregate data on the current and future state of circuit board technology and technical requirements, and the outlook for future PCB technology developments through 2023.
Survey participants will receive a complimentary copy of the 2018 PCB Technology Trends report. PCB engineers, designers or technologists interested in participating are invited to contact IPC’s market research staff at marketresearch@ipc.org or +1 847-597-2868 for access to the surveys. Both surveys are also available in Mandarin Chinese.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 4,300-member company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China. For more information, click here.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.