Global Sourcing Spotlight: Tariffs—The New Reality
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
SMTA International Conference Program Finalized and Registration Now Open
June 26, 2018 | SMTAEstimated reading time: 1 minute
The SMTA is pleased to announce that the program and registration for the SMTA International Conference and Exhibition is finalized and available on-line at www.smta.org/smtai. Taking place October 14-18, 2018 at the Donald Stephens Convention Center in Rosemont, Illinois, the conference features 20 workshops, 130 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing industry.
Technical tracks will cover the Technical Innovations Symposium, Harsh Environments Symposium, Advanced Packaging Technology; Manufacturing for Excellence - process and assembly; Substrates/PCB Technology; Flux, Solder and Adhesives; and Inspection Technologies. Engineers from major manufacturing companies like Celestica, IBM, Intel, Rockwell Collins, Sanmina Corporation, several universities and more will present their latest research on critical process improvements, new materials and technologies. One session on Monday afternoon comprised of all women presenters will be followed by a panel discussion on the technical achievements of women, mentoring, and STEM initiatives.
Twenty half-day educational workshops are offered Sunday and Monday from expert instructors on topics including Design and Assembly Process Principles, Basics in Troubleshooting, Solder Joint Reliability, Reflow, Wave and Rework Soldering, Defect Analysis, Cleaning, Ball Grid Array (BGA) issues, and more.
Rockwell Collins Project Manager, Ron Heberlein and Lockheed Martin’s Lead HMD Development Test Pilot, Tony “Brick” Wilson will highlight a dual keynote presentation Tuesday morning discussing the revolutionary design, development and pilot’s perspective of the Helmet Mounted Display System (HMDS) for the F-35 Fighter Jet.
Over 170 exhibiting companies will display equipment, materials, and services at the Electronics Manufacturing Exhibition, which will be held Tuesday and Wednesday, October 16 - 17. Attendees are invited to join the “Pick-n-Taste” Beer Tasting & Reception which will be held Wednesday, October 17.
IPC Fall Standards Development Committee Meetings and Sensors Midwest are co-located with the conference.
Several events at SMTA International are free to all attendees including Spotlight Sessions with presentations, Conformal Coating, Reflow Profiling, Reliability, Solder Alloys and Soldering. Other complimentary events available to all attendees are the Women’s Leadership Program, Fun Run, “Pick-n-Taste” Beer Tasting & Reception, Poster Session and the Metallographic Photo Contest.
About SMTA - A Global Association Working at a Local Level
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Share on:
Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.