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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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ICTC Expands U.S. Manufacturing with Trinity Acquisition

10/07/2026 | ICTC
Interconnect Cable Technologies Corporation (ICTC), a global contract manufacturer, is proud to announce the acquisition of Trinity Manufacturing Corporation, a cable and wire harness manufacturer based in Bradenton, Florida.

SMTA Launches Advanced Electronics Assembly Technologies Course

10/07/2026 | SMTA
The Surface Mount Technology Association (SMTA) announced a new Advanced Electronics Assembly Technologies course scheduled for November 10-12, 2026 from 9:00 AM to 1:00 PM US Central Time each day. Electronics industry veteran, Keith Bryant, instructs the course live via an online platform.

Qnity Introduces High-Temperature Sealing Solution for Semiconductor Manufacturing

10/06/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced Kalrez® 7080 perfluoroelastomer parts, a high-performance sealing solution engineered for semiconductor processes operating at temperatures up to 330°C.

Compal Earns Two Honors for AI Transformation at Digital Transformation Awards

10/06/2026 | Compal Electronics Inc.
Compal Electronics continues to advance its AI transformation, deepening the use of AI across manufacturing and enterprise management, and its progress has once again earned strong external recognition.

Global Electronics Association Names Jason Palmi Chief Financial Officer

10/06/2026 | Global Electronics Association
The Global Electronics Association announced that Jason Palmi has joined the organization as Chief Financial Officer.
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