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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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IDI Dynamics Debuts High-Speed Laser Marker for Semiconductor OSAT

05/29/2026 | PRNewswire
IDI Dynamics, a subsidiary of ISDN Holdings Limited, has launched its next generation High-speed Laser Marker for semiconductor chip packages, with a dual value proposition of delivering 2.5x higher marking speed and occupying 22% less physical footprint.

ASE Launches Automated 310mm Panel-Level Packaging to Accelerate AI Innovation

05/27/2026 | BUSINESS WIRE
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. and a leading provider of semiconductor assembly and test services, announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies.

ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung

05/08/2026 | ASE Group
Advanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung. 

Designing Without a Rulebook: When Engineering Becomes Innovation

05/05/2026 | Stephen V. Chavez, Siemens EDA
What if the very rules that made you successful as a PCB designer are the ones now holding you back? This reminds me of walking the floor and attending sessions at both PCB West 2025 and APEX EXPO 2026, where one common theme stood out: More designs with traditional PCB “best practices” simply don’t apply. It’s not because they’re wrong, but because the problems we’re solving have fundamentally changed. In some cases, those best practices can actually limit performance. This is where PCB design moves beyond optimization and into something far more challenging: designing without a rulebook.

LPKF Gets Off to a Solid Start in 2026

05/04/2026 | LPKF
LPKF Laser & Electronics SE has made a solid start to the 2026 financial year despite a macroeconomic environment that remains challenging.
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