-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Intertronics: How to Specify a Dispensing Robot to Increase Quality and Cut Costs
July 3, 2018 | IntertronicsEstimated reading time: 2 minutes
Automated application of adhesives, potting compounds or encapsulants, sealants, FIP gaskets, temporary masking, lubricants, or other liquids, fluids or pastes provides productivity benefits over manual application, including consistency, speed and accuracy. As selection of a dispensing robot is sometimes a daunting task, Intertronics, a specialist adhesives and dispensing company, has compiled a short piece of guidance on how to specify a dispensing robot. The full guidance can be found on their blog at www.intertronics.co.uk/specify-robot.
When specifying a dispensing robot, it is important to understand that a so-called dispensing robot consists of four main components: the robot itself; the dispensing equipment; tooling to attach the dispenser to the robot and to hold the parts to be dispensed on; and an enclosure to protect both the robot and its users. Each of these components can be specified separately, but need to be compatible with each other to ensure a complete and fully operational system. The equipment supplier should be able to assist with this, and may have suggestions for a complete system based on the customer’s application.
The list of considerations for the components of a dispensing robot include work area, Z height, number of axes, weight of parts, weight of payload, load/unload process, accuracy, tolerance and repeatability. All of these are explained in greater detail, along with leading questions, in the full guidance.
Depending on application requirements, there are several dispensing methodologies to consider. The supplier should be able to help discern the most suitable methodology for the application and requirements, as well as with assembly and integration of the completed dispensing robot.
Once the dispensing robot has been specified, purchased and delivered, full training should be given to all users. This may be available from the equipment supplier.
Explains Intertronics M.D. Peter Swanson, “Automating the dispensing process can have significant effects on productivity and product quality. Robots, particularly benchtop robots, offer fast return on investment and a good level of capability when coupled with appropriate dispensing equipment. We have seen substantial improvements in consistency, speed, accuracy and reliability of the dispensing process with our customers who have implemented automated dispensing. This leads to cost savings in materials, production times and reduced rework.
“We have compiled “How to specify a dispensing robot” to help others toward that first step in the process, but we are also happy to walk through the specification process in detail with technology manufacturers who are considering automating their dispensing process. We can, of course, supply all of the components as a completed robotic dispensing system with process integration and training.”
Suggested Items
Ather Energy, Infineon Technologies Partner to Accelerate India’s Electric Two-wheeler Revolution
05/30/2025 | InfineonAther Energy, a leading electric two-wheeler manufacturer in India and Infineon Technologies Asia Pacific Pte Ltd, a global leader in semiconductor solutions, signed a Memorandum of Understanding (MoU) in Seoul, South Korea, to jointly drive innovation in the electric vehicle (EV) industry in India.
OSI Systems Receives $47 Million Services Order for Security Inspection Systems
05/30/2025 | BUSINESS WIREOSI Systems, Inc. announced that its Security division received a $47 million order from a U.S. based customer to provide ongoing maintenance service for its installed base of Rapiscan® inspection systems that are utilized for screening baggage, cargo and vehicles.
Honda to Co-develop Refueling Port Connecting System for On-orbit Satellite Refueling with Astroscale
05/30/2025 | JCN NewswireHonda R&D Co., Ltd., a research and development subsidiary of Honda Motor Co., Ltd., will co-develop a refueling port connecting system designed for on-orbit refueling of satellites, with Astroscale Japan Inc., a subsidiary of Astroscale Holdings Inc.
Elbit Systems Expands Naval Defense Footprint with a Series of Recent Contract Wins
05/29/2025 | Elbit SystemsElbit Systems Ltd has recently been awarded several contracts by international customers including NATO member countries, underscoring the company’s growing role in strengthening naval defense capabilities for customers around the world.
Siemens Expands OSAT Alliance Membership to Build Domestic Semiconductor Supply Chains
05/29/2025 | SiemensSiemens Digital Industries Software announced the latest members to join its OSAT Alliance program which enables outsourced semiconductor assembly and test (OSAT) providers to develop, validate and support integrated circuit (IC) package assembly design kits (ADKs) that drive broader adoption of emerging technologies by fabless semiconductor and systems companies and help to build secure domestic semiconductor supply chains.