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SMT Mounter Market Size Projected to Reach $5.06 Billion by 2030

12/23/2024 | openPR
According to the new market research report "Global SMT (Surface-mount Technology) Mounter Market Report 2024-2030", published by QYResearch, the global SMT (Surface-mount Technology) Mounter market size is projected to reach USD 5.06 billion by 2030, at a CAGR of 4.7% during the forecast period.

Saab Receives Order from Sweden for Sea Giraffe 1X Naval Radar

12/16/2024 | Saab
Saab has received an order from the Swedish Defence Materiel Administration (FMV) for the Sea Giraffe 1X radar system to the Swedish navy. The order value is approximately SEK 340 million with deliveries 2024-2026.

Fresh PCB Concepts: PCB Plating Process Overview

12/12/2024 | Team NCAB -- Column: Fresh PCB Concepts
In this installment of Fresh PCB Concepts, Mike Marshall takes the helm stating: PCBs have been the platform for the interconnection of electronic components for decades. Because of process costs and other constraints, such as mechanical properties or size limitations of the alternatives, PCBs will remain the standard low-cost interconnection technology. Rapidly increasing performance and functionality requirements of wireless and high-speed devices have challenged the development and implementation of new manufacturing solutions.

Dana on Data: Merging 2D Electrical, 3D Mechanical Worlds

12/04/2024 | Dana Korf -- Column: Dana on Data
Imagine the day when placing components and routing signal traces and power planes are not constrained by 2D PCB fabrication processes and materials. Astronauts working on the space station have equipment mounted on all axes. They are not constrained by having to stand on a flat surface. They already have a 3D printer at the space station. Why can’t we create PCBs in a 3D space?

Connect the Dots: Designing for Reality—Pattern Plating

10/16/2024 | Matt Stevenson -- Column: Connect the Dots
In the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.
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