-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Neways Gears Up to Address Miniaturization Trend
July 13, 2018 | Neways Electronics International N.V.Estimated reading time: Less than a minute
Products are becoming increasingly smaller and embed more functionality. Because the existing technologies that accommodate this trend are expensive alternatives, Neways Micro Electronics has started to find a technology that aims to provide a cost-effective solution that is easily integrated in the standard production processes.
Together with its partners, Neways is developing a technology to lithographically pattern printable noble metal pastes (photoimageable thick film technology) as a robust industrial solution for the miniaturization of electronic applications. As such, a typical size reduction of factor of four can be achieved when compared to conventional solutions.
Currently, the project team is entering the industrialization phase of this innovation, in which they demonstrate the performance of the process in the industrial environment. The technology has already been proven in concept prototyping as well as in small batch production runs and is already available to key customers. This year, Neways plans to release it as a fully qualified volume production process.
Typical applications that already make use of this technology are to be found in smart wearables, ultra-miniaturized sensors, photonics applications, and high speed data transceivers.
Suggested Items
Neways, Teledyne FLIR Sign Frame Agreement for Ramp-up of Defense Business
06/21/2025 | NewaysNeways, the global innovator in mission-critical technology for leading semicon, defense & mobility, and connectivity companies, has signed a frame agreement with Teledyne FLIR. Teledyne FLIR is a global leader in thermal imaging infrared cameras that are applied in government & defense, industrial, and commercial markets.
Neways, BAE Systems Hägglunds Sign Long-term Supplier Agreement
06/12/2025 | NewaysBy signing the LTSA, Neways and BAE Systems Hägglunds further cement the long-time collaboration that started more than 15 years ago when Neways first supported BAE Systems in delivering an early fleet of CV90 armored vehicles: a platform that has been ordered in over 1,900 vehicles globally.
Neways Electronics Celebrates Grand Opening of New Manufacturing Facility in Malaysia
05/22/2025 | Neways Electronics International N.V.Neways, the global innovator in mission-critical technology for semicon, defense & mobility, and connectivity sectors, is proud to announce the grand-opening of a new state-of-the-art manufacturing facility in Selangor, Malaysia.
Neways Firmly Expands Defense Business
04/21/2025 | NewaysNeways Electronics, the global innovator in mission-critical electronics, foresees very strong growth in its defense-related activities in the near term.
Neways Partners with MilDef for the Production of Advanced Electronic Components
11/15/2024 | NewaysNeways, the global innovator in mission-critical technology for leading semicon, connectivity and smart mobility companies, announces it has entered into a partnership with MilDef, the developer of world-leading tactical IT solutions, products and systems, made to perform in the toughest conditions.