Rehm Successfully Participates in CEIA Conference in China

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Over the past decade, Rehm Thermal Systems has operated successfully and expanded strongly in eastern and northern China. The company's many years of SMT manufacturing expertise was recently communicated by Wang Yu, sales director of Rehm Eastern and Northern China, at the China Electronic Intelligent Automation (CEIA) Forum in Qingdao.

More than 200 PCB manufacturing, consumer electronics, medical electronics and aerospace experts attended the event. Yu's technical lecture dealt with the use of void-free soldering technology with Rehm soldering systems. The ultimate goal is to reduce the void rate to a minimum during the production process and further improve end product quality. Lower void rates can be achieved with soldering processes only where the molten solder is subjected to a vacuum, thus facilitating the escape of any residues remaining in the soldering joint. Rehm offers this process with the VisionXP+Vac for convection soldering and the CondensoX series for condensation soldering.

The regular exchange of knowledge and experience with industry colleagues is becoming ever more important in China, too. Rehm participates in numerous trade fairs and events with experts and accompanies specialist seminars with lectures on the topic of soldering.

A look at the expert forum

Technical lecture by Wang Yu

About Rehm Thermal Systems

As a specialist in thermal system solutions for the electronics and photovoltaics industry, Rehm is a technology and innovation leader in state-of-the-art, cost-effective manufacturing of electronic assemblies. As a globally active manufacturer of reflow soldering systems with convection, condensation and vacuum, drying and coating systems, functional test systems, equipment for metallisation of solar cells as well as numerous customised systems, we have a presence in all key growth markets and, as a partner with more than 25 years of industry experience, are able to implement innovative production solutions that set new standards.