-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Park Electrochemical’s Neltec Business Unit Appoints Steve Lach as President
July 18, 2018 | Park ElectrochemicalEstimated reading time: Less than a minute
Park Electrochemical Corp. announced the appointment of Steven N. Lach as president of Neltec Inc., Park’s electronics business unit based in Tempe, Arizona. In this position, Mr. Lach will report to Chris Mastrogiacomo, president and chief operating officer of Park Electrochemical Corp.
Lach has had an extensive career in the printed circuit board industry, and has served in senior management positions at Sanmina Corporation, Continental Circuits Corporation and Hadco Corporation.
About Park Electrochemical Corp.
Park Electrochemical Corp. is a global advanced materials company which develops and manufactures advanced composite materials, primary and secondary structures and assemblies and low-volume tooling for the aerospace markets and high-technology digital and RF/microwave printed circuit materials principally for the telecommunications and internet infrastructure, enterprise and military markets. The Company’s manufacturing facilities are located in Kansas, Singapore, France, Arizona and California. The Company also maintains R&D facilities in Arizona, Kansas and Singapore.
Suggested Items
Federal Electronics Adds AS9100 Certification to Hermosillo, Mexico Facility, Expanding Aerospace & Defense Capabilities
05/20/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has officially added AS9100 certification to its Hermosillo, Mexico facility, further aligning its operations with the quality standards required by the aerospace and defense industries.
Merlin Circuit Technology Earns NADCAP 2nd Year Merit
05/13/2025 | Merlin Circuit TechnologyMerlin Circuit Technology Ltd, a leading manufacturer of advanced printed circuit boards (PCBs) for mission-critical applications, has announced the successful completion of its latest NADCAP audit, achieving prestigious 2nd Year Merit Status.
Vertical Aerospace, Honeywell Expand Partnership to Bring VX4 eVTOL to Market
05/13/2025 | HoneywellVertical Aerospace and Honeywell announced the signing of a new long-term agreement that expands their existing partnership and reinforces Honeywell’s commitment to the certification and production of Vertical’s electric vertical take-off and landing (eVTOL) aircraft, the VX4.
Barnes Aerospace Appoints George Whittier as CEO
05/12/2025 | BUSINESS WIREBarnes Aerospace, a global provider of component repair services and manufacturer of highly-engineered parts primarily for aeroengines and an operating division of Barnes Group Inc., announced the appointment of George Whittier to the newly created role of CEO, effective May 12, 2025.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.