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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Summer Issue of Flex007 Magazine Available Now
July 25, 2018 | Andy Shaughnessy, Flex007 MagazineEstimated reading time: 1 minute
An increasing number of OEMs are being forced into using flexible and rigid-flex circuits, for a variety of reasons: Sometimes rigid boards won’t fit the shrinking enclosures anymore, or the companies just need rugged, reliable circuits.
In the July 2018 issue of Flex007 Magazine, our contributors discuss some of the hurdles they faced when they dove into flex and rigid-flex circuits, and they offer advice to anyone considering a move into the flexible arena.
Check it all out this month in Flex007 Magazine, now on the virtual newsstand and available for delivery in your e-mailbox each month by subscribing here.
Be sure to download the PDF copy or future reference. The PDF is great for beach reading!
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Simon Khesin - Schmoll MaschinenSuggested Items
OE‑A Publishes 10th Edition of the Roadmap for Flexible and Printed Electronics
04/22/2026 | OE-AWith the publication of the 10th edition of the “OE-A Roadmap for Flexible and Printed Electronics,” the OE-A, an international working group for printed electronics within the VDMA, once again presents the central guidance and reference document for the industry.
Global Flexible PCB Market to Nearly Double, Reaching $41.7 Billion by 2030
04/03/2026 | Globe NewswireThe global flexible printed circuit board (FPCB) market is projected to grow from $21.5 billion in 2024 to $41.7 billion by 2030, reflecting a compound annual growth rate (CAGR) of 12.3%, according to a new report from BCC Research.
China’s Top 3 FPC Manufacturers 2026: Advancing Sustainable Flexible Electronics
03/25/2026 | EINPresswire.comThe global transition towards compact, lightweight, and durable electronic devices is accelerating demand for advanced Flexible Printed Circuits (FPCs).
SMT Renting: Redefining Equipment Investment
03/24/2026 | Marcy LaRont, I-Connect007SMT Renting, based in Copenhagen, is challenging the traditional machine-ownership model with a flexible, service-based approach. Business Manager Christian Thers discusses how rental options, “stop and swap” flexibility, and a new pay-per-placement model help electronics manufacturers reduce risk and adapt quickly in an unpredictable market.
Global Market for Flexible Manufacturing Systems Set to Surge to $22.2 Billion by 2030
03/02/2026 | GlobeNewswireAccording to the latest study from BCC Research, “Global Market for Flexible Manufacturing Systems” is expected to increase from $15.2 billion in 2025 to $22.2 billion by the end of 2030, at a compound annual growth rate (CAGR) of 7.9% from 2025 through 2030.