Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Altus Highlights Heller Industries Advances in Void Reduction Under 1%

01/06/2025 | Altus Group
Altus Group, a leading distributor of capital equipment in the UK and Ireland, emphasises the importance of reducing voids in reflow soldering to improve manufacturing efficiency and product reliability

IPC Announces UK Regional Qualification for Hand Soldering Competition

01/02/2025 | IPC
IPC  invites skilled soldering experts to participate in the UK Regional Qualification for the IPC Hand Soldering Competition (HSC) on February 4-6, 2025, at the Farnborough International Exhibition Centre.

Connect the Dots: Designing for Reality—Solder Mask and Legend

01/02/2025 | Matt Stevenson -- Column: Connect the Dots
In the previous episode of I-Connect007’s On the Line with… podcast, we discussed the strip, etch, and strip process. At this point, we have a functioning board, but we still need to protect the PCB from environmental effects and document the circuit components. This brings us to the solder mask and legend phase of production.

Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5

12/23/2024 | I-Connect007 Editorial Team
Chapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.

Overview of Soldering Systems With Vacuum

12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbH
When soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in