SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Standard of Excellence: Overcoming Service Failures—The Art of the Apology
Nolan’s Notes: Tariffs, Technologies, and Optimization
Evaluating the Impact of Powder Size and Stencils on Solder Paste Transfer Efficiency
July 31, 2018 | T. O’Neill, C. Tafoya, and G. Ramirez, AIM Metals and AlloysEstimated reading time: 9 minutes
Figure 3: Print performance of Types 4 and 5 powder with 0.5 mm BGA.
Figures 3 and 4 show that that all the print results were within our prescribed limits of 80% TE and ≤10% CV for both T4 and T5 pastes and coated and uncoated stencils. Comparing the results of T4 and T5, T5 gives very little advantage over T4, with the one slight exception being uncoated stencils on 0.4 mm BGAs with an AR of 0.62.
More striking than the powder size comparison is the impact of coated stencils on print consistency. In every case, the coated stencil deposited similar or greater amounts of solder paste with half the variation. Cutting CV by half is a profound improvement in process control.
Figure 4: Print performance of Types 4 and 5 powder with 0.4 mm BGA.
To the printing specialist, this data should facilitate the decision between finer powder and nanocoating as means to improve release and the overall solder paste printing process. Nanocoating has a significantly more positive effect on both increasing TE and, most importantly, reducing CV.
To read the full version of this article, which was published in the June 2018 issue of SMT007 Magazine, click here.
Page 3 of 3Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.
SASinno Americas Introduces the Ultra Series
10/07/2025 | SASinno AmericasSASinno Americas has introduced the new Ultra Series, the latest generation of offline selective soldering systems. Available in two models—the Ultra-i1 and Ultra-i2—the new series is designed to meet the needs of manufacturers running small to medium batch sizes, multiple product types, and frequent line changes, while maintaining exceptional precision and process control.
Elmotec by E-Tronix to Showcase SolderSmart® TOP Robotic Soldering at The Assembly Show 2025
10/06/2025 | ELMOTECE-tronix, a Stromberg Company, is pleased to announce its participation at The Assembly Show 2025 in Rosemont, IL, October 21st through 23rd. Exhibiting under Elmotec by E-Tronix, Booth #448, the team will highlight the SolderSmart® TOP robotic soldering system, featuring live demonstrations throughout the show.