Agfa: Staying Ahead of the Technology Curve
August 1, 2018 | Barry Matties, I-Connect007Estimated reading time: 5 minutes

In the ultracompetitive electronics manufacturing space, companies that don’t continually evolve and invest in new technologies run the risk of being left behind. At the recent EIPC summer conference, many next-generation processes and technologies were discussed and even put on display. Publisher Barry Matties spoke with Agfa’s newly appointed Global Sales Manager, Mariana Van Dam, to talk about how her company, typically known for its phototooling products, continues to evolve by developing inkjet printing, solder mask and additive technologies.
Matties: Mariana, please give a brief intro of yourself and Agfa for our readers.
Van Dam: I’ve been with Agfa for two-and-a-half years. I started as New Business Development and Product Manager and have moved on to the position of Global Sales Manager since October 2017. Prior to Agfa, I have worked in different positions related to products for the printed circuit board industry.
Agfa is known in the PCB industry for phototooling, which we have been doing for many years; it is an important product for us still, but some years ago we started with the development of a digital solution. We are now developing functional inks for inkjet printing. We have UV inkjet legend inks, etch resist and we are very far advanced with the solder mask.
Matties: The solder mask is the exciting news.
Van Dam: Yes, that's the one that is getting very high interest from the market. We are excited about it and really have great confidence that this will become a success.
Matties: When we last talked you were well into the process, but I think just starting into the beta site of things.
Van Dam: Yes. Now we believe that the product is “as good as” ready. We are still doing beta site testing, but our product meets all the IPC standards and the additional automotive standards. But solder mask is a complex product and we feel we must test it thoroughly. Because we need the feedback from the customers, there may be requirements we haven't tested yet that we have to look at, so that is ongoing. We have sites in Europe and the U.S.
Matties: Are the equipment manufacturers also in cooperation in the process?
Van Dam: Yes, we work with the different equipment manufacturers that produce inkjet equipment for solder mask. So it's always a three-way with the customer, the equipment manufacturer and Agfa. We have to work together, because the equipment side and the printing strategy are very important. It's not only the ink, it really goes together.
Matties: The benefits from applying with the jets are both to process reductions and the accuracy, especially as we move into a world of HDI. What sort of feedback are you getting from your beta sites?
Van Dam: Right now, it's quite sufficient for the requirement of most PCB companies. Inkjet equipment is also evolving and there are printheads available now with very small nozzle sizes. Because of this evolution it is possible to obtain really fine features.
Matties: How do you overcome the speed issue?
Van Dam: That's more from the equipment side; you can increase the speed by adding more printheads.
Matties: So it’s just a function of the number of pieces of equipment that you have in there.
Van Dam: Yes. You see this with the legend ink inkjet that is now an accepted production method. Initially this was a smaller machine with one head or two printheads; today there are machines for mass production. In China you see equipment with eight printheads. They're being installed now.
Matties: Ultimately, you would like to see the big shots in China adopting this technology because there are so many benefits. But the speed answer must be there in an economical way.
Van Dam: Yes. At the moment, the equipment is also in the final stage of development for the solder mask application. It's a new production method and I think initially it will be mainly the quick turnaround and prototype shops where we will start. But we have indeed seen a lot of interest for the mass production also. They already ask for it, so it will get there eventually for sure.
Matties: Orbotech was speaking earlier about some exciting equipment for solder mask coming out.
Van Dam: Yes, indeed, the equipment is not released yet, but they are really working on it and we also work together with them like we work together with the other manufacturers.
Matties: I remember in the past some equipment suppliers brought out equipment, but you could only use their inks, and I thought that was a mistake.
Van Dam: Yes, I think it must be decoupled because I think also that customers, certainly in mass production, want dual supply. If the product is so critical and so important you cannot rely on one supplier, you need to be able to have multiple options.
Page 1 of 2
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
Absolute EMS: The Science of the Perfect Solder Joint
09/05/2025 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is drawing attention to the critical role of 3D Solder Paste Inspection (SPI) in ensuring the reliability of both FLEX and rigid printed circuit board assemblies (PCBAs).
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.
Dr. Jennie Hwang to Present on ‘Solder Joint Reliability’ at SMTA International 2025
09/03/2025 | Dr. Jennie HwangDr. Jennie Hwang to address “Solder Joint Reliability” at the 2025 SMTA International Conference on Monday, October 20. Leveraging her decades of extensive real-world experiences and deep knowledge,