-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Gen3 Systems Delivers Nordson Selective Soldering System to CIL
August 6, 2018 | Gen3 SystemsEstimated reading time: 2 minutes

Gen3 Systems has supplied the Nordson SELECT Novo 460 PD Selective Soldering System for Custom Interconnect Ltd's production facility in Andover.
The Novo 460 PD System for CIL is designed to process 460mm x 460mm (18.1" x 18.1") assemblies entirely without intervention and is the biggest system in the Nordson SELECT range. Automatically applying flux and solder to through-hole component leads without disturbing neighboring SMT components, the Novo 460 PD System provides solder quality that is significantly superior to hand soldering with full barrel fill and top side fillets consistently produced. They out-perform at least five hand-soldering operators providing a return on investment that can be measured in days.
The Integrated Manufacturing Division of CIL was formed in 1987 and has grown extensively over the years to become one of the major specialist electronics manufacturing service (EMS) providers available today.
"After reviewing other systems on the market it was an easy decision to make. A combination of the machines overall capability and the dual solder pot system soon made the 460 PD System the solution we were looking for. As well as SAC305 RoHS alloy soldering systems we still have a number of military customers who still require tin/lead soldering. We can utilize the dual pot system on the 460 PD by filling one pot with SAC305 alloy and the other with tin/lead alloy. As each board type is programmed into the machines software, we can configure it to use only the relevant solder pot with zero chance of cross contamination. We have therefore ended up with an auto thru hole soldering system in both SAC305 and tin/lead, which has enabled CIL to phase out both of its older CMS400 wave soldering systems," said John Boston, managing director of CIL.
"This latest equipment installation adds to the collection of production and test equipment supplied to CIL by Gen3 Systems. The Novo 460PD is a very flexible selective soldering system and the way this one has been configured ticks all the boxes for contract manufacturers. The Novo 460 PD is easy to maintain and programme and these things are vitally important to a company like Custom Interconnect Limited," said Nick Plumb, Gen3's global operations manager.
About Gen3 Systems
Gen3 Systems is a specialist manufacturer of test and measurement equipment used to help predict reliability of electronic circuits and systems in the field. In addition, the company designs and manufactures dip and spray coating process equipment in both in-line and bench-top formats. Gen3 is a specialist distributor for several leading equipment manufacturers including, Nordson SELECT, FineTech, MBTech, MEK, Hirox, Optilia and, Aprotec Instrumentation, Solder Paste Inspection (SPI) systems.
Gen3 Systems also provides training, equipment and expertise for manufacturers requiring assessment of their electronic products’ reliability. The company also operates a test service and assists with standards development via both the IPC and IEC. Gen3 Systems operates from premises near Farnborough Business Park, on the M3 corridor and just 30 minutes from London’s Heathrow Airport.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.