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Advanced Electronics Packaging Digest

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35 Years of Innovation from Jena: GÖPEL electronic Celebrates Its Anniversary

05/19/2026 | GÖPEL electronic
In May 2026, GÖPEL electronic will celebrate its 35th anniversary. Founded in 1991 as a spin-off of Carl Zeiss Jena Measurement and Testing Technology, the company has continuously evolved and is now one of the world’s leading providers of innovative test and inspection systems, with approximately 240 employees as well as locations and partners in more than 25 countries.

Incap India Invests in Testing and SMT Upgrades to Scale Production

05/15/2026 | Incap
Incap India has completed the installation of a new flying probe test system and a full SMT (Surface-Mount Technology) line upgrade at its Tumkur factory.

BAE Systems Provides Advanced Aircraft Readiness with New Link 16 Test Capability for F-16

05/14/2026 | BAE Systems
BAE Systems has completed the successful development and integration of an upgraded Link 16 test capability for Multifunctional Information Distribution System Joint Tactical Radio System (MIDS JTRS) terminals on U.S. Air Force F-16 aircraft.

Separating Fact from Fear on the FCC ‘China Lab Ban’

05/14/2026 | Jan Pedersen, NCAB Group
Recent news headlines have suggested that the U.S. Federal Communications Commission (FCC) has “banned all testing laboratories in China and Hong Kong.” Understandably, this has created concerns around PCB testing, material approvals, UL listings, and the continued use of established test laboratories in Asia. The good news is that for most PCB, PCB material, and PCBA testing, nothing has changed. Let’s separate fact from fear.

yieldWerx, WATS Partner to Bridge PCB Test with Chip-Level Manufacturing Data

05/11/2026 | PRNewswire
Board-level and semiconductor test data are often analyzed separately, limiting correlation across the product lifecycle. Linking PCB assembly (PCBA) test results, including in-circuit and functional test, with upstream wafer, sort, and final test data remains difficult, particularly in photonics, advanced packaging, and high-density integration environments.
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