TactoTek and IMSE Technology Partners Host IMSE Solution Day 2018
September 3, 2018 | TactoTekEstimated reading time: 1 minute
TactoTek and IMSE Technology Partners are hosting IMSE Solution Day—an event dedicated to IMSE technology, product design and manufacturing. The event responds to interest from OEMs, manufacturers and designers, in an IMSE-focused event and interaction across the IMSE ecosystem.
IMSE Solution Day is being hosted by a cross-section of IMSE technology leaders, including materials providers DuPont, Sun Chemical, Inkron, Pröll, MacDermid and Covestro; touch control leaders Cypress and Microchip; LED lighting innovator OSRAM; equipment vendors for key manufacturing processes, Essemtec and Niebling, design software publishers Dassault Systémes and Altium and TactoTek.
“Demand for IMSE solutions is maturing in several industries, including automotive, appliances, IoT products and wearable technology,” noted Dave Rice, SVP marketing at TactoTek. “Commercializing IMSE technology has been a team effort with our Technology Partners and our customers. By transforming the way that electronics are designed and built with IMSE, together we’re creating products that inspire users.”
About TactoTek
TactoTek is a leading provider of solutions for Injection molded structural electronics (IMSE) that integrate printed circuitry and electronic components into 3D injection molded plastics. Leading use cases include in-vehicle applications, home/industrial appliances, and wearable technology. TactoTek adapts customer designs to IMSE technology, develops mass production ready prototypes, and mass produces or licenses the technology for 3rd party mass production. TactoTek is funded by Conor Venture Partners, Ascend Capital Partners, Faurecia Ventures, Plastic Omnium, Nanogate, VTT Ventures and Leaguer VC. For more information, please click here.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.