Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Alpha to Partner with Lenz for Technical Seminar in Warsaw
September 4, 2018 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions will present its expert knowledge on optimizing SMT, wave and manual soldering processes with emphasis on low-temperature solutions and preform technologies at the upcoming technical seminar hosted by Lenz, Alpha’s premium distributor for Poland. The seminar will be held on Thursday 20th September in Warsaw.
Corné Hoppenbrouwers, sales and technical support for Alpha Assembly Solutions, will present on SMT, wave and hand soldering best practices as well as low-temperature soldering solutions. Corné will discuss the benefits of Alpha’s revolutionary HRL1 solder alloy which was designed to exhibit improved drop shock and thermal cycling performance over existing low temperature alloys. ALPHA HRL1 paired with the ALPHA OM-550 low-temperature chemistry blends to create a high reliability solder paste product which delivers a reduction in component and board warpage of up to 99%, as well as significantly improved BGA mechanical reliability compared to other low temperature alloys.
Daniele Perico, engineered materials development manager for Europe for Alpha Assembly Solutions, will present on the benefits of using preform technologies, such as alpha exactalloy tape and reel preforms, for PCB assembly. Preforms enable the precise increase of solder volume for improved joint reliability, as well as reduced flux residue for increased electrical reliability and void reduction under component thermal pads.
Alpha and Lenz Sp.j have enjoyed a successful partnership for over 20 years, with Lenz supplying Alpha products throughout Poland.
The Technical Seminar will be held at the Radisson Blu in Warsaw, Poland from 09:00am on Thursday 20th September. As well as presentations from Alpha, representatives from Kyzen and Tecnometal will also give technical presentations.
To register for the event, click here.
About Lenz Sp.j
Lenz has operated in the electronics industry since 1991. Over the years Lenz has gathered extensive knowledge of soldering processes, materials, machines and equipment. As well as offering the highest quality products, Lenz provides techical solutions, solder composition analysis services and advice on the implementation of their products.
For more information please, click here.
About Alpha Assembly Solutions
Alpha Assembly Solutions, part of the MacDermid Performance Solutions group of businesses, is the world leader in the development, manufacturing and sales of innovative specialty materials used for electronics assembly, die attach and semiconductor packaging in a wide range of industry segments, including automotive, communications, computers, consumer, power electronics, LED lighting, photovoltaics, and others.
As the electronics industry continues to evolve, Alpha is focused on developing novel and unique processes for solving assembly challenges. Whether traditional electronics assembly, die attach or emerging applications, such as flexible and formable electronics, Alpha designs solutions for manufacturing that looks at how multiple products can interact in the same environment to provide customers with the most effective assembly solution for their application.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality materials with a focus on sustainability and recycling services. For more information, click here.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.