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Koh Young SPI Now Dispenses Solder Paste for Microchips
September 4, 2018 | Koh Young TechnologyEstimated reading time: 2 minutes
Koh Young Technology’s 3D SPI (solder paste inspection) system has now expanded its solution to perform complex dispensing. Koh Young highlighted the latest innovations, including its new high-precision, integrated dispenser for the KY8030-3 3D SPI, in Stand 1F45 at NEPCON South China, August 28-30, 2018 in Shenzhen, China.
Insufficient solder paste is a common defect in electronics assembly due in part to stencil design challenges stemming from component geometries and decreasing pad sizes. Increasing component density and tighter tolerances further complicate solder paste deposition. Insufficient solder can result in a weak solder joint, which will develop stress cracks on solder joints. The cost implications quickly accumulate, especially when multiple boards prototypes are manufactured in high volume. If defective, the PCB must be cleaned, reprinted, or scrapped, which increase production costs. Using the KY8030-3 SPI system to identify solder issues, and then dispense additional solder, can eliminate these repair costs.
The Koh Young KY8030-3 can perform the function of multiple machines. It becomes a dispensing solution when the Auto Repair feature is added; yet, it maintains its 3D SPI capabilities to accurately identify defects and root causes, especially when combined with powerful KSMART SPC features. An integrated dispenser within the KY8030-3 achieves micrometer precision and delivers dispensing capability for 0402M (01005) pads and larger. The Koh Young Auto Repair feature provides superior design benefits to maximize profitability and improve ROI.
The 3D inspection leader also highlighted 3D Zenith AOI, as well as new solutions like for 3D Pin inspection (KY-P3) and 3D machining optical inspection (Infy). The new KY-P3 delivers true 3D inspection for various types of pin connections with unsurpassed accuracy. This latest innovative system provides fast inspection setting and modification based on quantified inspection results.
Additionally, Koh Young demonstrated how its integrated KSMART solutions establish perfect data feedback using quality data. The KSMART solution is a measurement-based process analysis solution, which allows manufacturers to implement industry 4.0 with reliable full 3D measurement data. This year, Koh Young highlighted key features of KSMART solutions like SPC@KSMART, Link@KSMART, OPO@KSMART (Offline Programming Optimizer), LM@KSMART (Library Manager), RTM@KSMART (Real-time Monitoring), and RMS@KSMART (Remote Monitoring System).
About Koh Young Technology
Koh Young Technology, the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to its corporate headquarters in Seoul, Koh Young has regional sales and support offices in Germany, Japan, Singapore, China, Mexico, and the United States. These local facilities ensure Koh Young maintains a close relationship with its growing customer base, while providing them with access to a global network of 3D measurement and process experts.
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