-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Seica to Participate at SMTA International 2018
September 12, 2018 | SeicaEstimated reading time: 3 minutes

Seica Inc., will be exhibiting at the SMTAI trade show to be held in Chicago, IL on October 16 – 17, 2018. Seica’s Pilot V8 automated flying prober will be on display in booth #424. The Pilot V8 Next> series is Seica’s latest innovative flying prober on the market today. It’s ability to test traditional loaded boards is unmatched in today’s market, but also its ability to test wafers, substrates, MLOs and assemblies is quite extraordinary. From NPI pilot runs to full production runs, with its fast ICT test capabilities the system can also be configured to regenerate netlists and schematics for circuit assemblies that have no data whatsoever. The system can also be configured for functional testing such as; power up, boundary scan, flash programming, and LED testing or using Seica’s functional language the user can create their own test code or run National Instruments Teststand Labview sequences. Seica will also discuss many other product offerings from bed of nails testers, to automation equipment, conformal coat and THT (Dragonfly) test systems, and our laser based selective solder system called the Firefly.
Pilot V8 Next > series, the most complete flying probe test platform on the market, provides up to 20 mobile resources for testing an electronic board, including test probes which can each apply up to 2A current, high-resolution cameras for automatic optical inspection, barcode and data matrix reading, laser sensors, capacitive probes, pyrometers, optical fiber sensors for LEDs, minifixtures for boundary scan and On Board Programming, high-frequency probes able to measure signals at frequencies over 1.5 GHz (an absolutely unique performance on the market). Engineered for medium/high volume production, the Pilot V8 Next > series is available in a fully-automated version, capable of hosting from 1 to 12 racks of boards to be tested (even of different types) or for direct connection to board loading/unloading and tilt modules, compatible with any standard assembly line. The Pilot V8 Next > can be configured to satisfy the full range of different board test requirements: the HR version extends the performance to include probing of extremely miniaturized devices (down to 30 µm), while in the XL version expands the standard work area from 610 x 540 mm to 800 x 650 mm, able to accommodate and test “extra-large” boards.
The Firefly Next > series, represents a major technological advance in laser selective soldering. The result of a totally new design and engineering effort, it includes a state-of-the art high-efficiency LASER source, a new spot angle on the board to be soldered, a fully-programmable donut spot and the perfect integration on a single axis of the laser, vision system and temperature sensor, which enables simple calibration and provides continuous, closed loop feedback from the soldering process, which greatly surpasses the levels of performance available until now in terms of throughput, applicability and reliability.
Dragonfly Next > series is an AOI system providing optical inspection capabilities of conformal coating as well as THT components on electronic boards. Both the THT and CC versions of the Dragonfly include a SMEMA compliant rail conveyor, can be configured to inspect one or both sides of the board, and an intuitive and streamlined management software environment which enables the user to develop and deploy an application program in a few hours.
Discover the performance at Booth #424.
About Seica
Founded in 1986, Seica S.p.A. is an innovative, high technology company that develops and manufactures leading-edge solutions for the test and selective soldering of electronic boards and modules. Combining deep expertise in electronics technology as well as in industrial machines and processes has enabled Seica to become a global leader and supplier of test and manufacturing solutions, with an installed base of more than 2000 systems on 4 different continents. Seica has fully embraced the concept of Industry 4.0, developing solutions to monitor and collect information from machines and industrial plants to enable the optimization of manufacturing processes, maintenance and energy management.
Company headquarters are located in Strambino, Italy, with direct offices in USA, Germany, China, Mexico and France, supported by a vast distribution network covering the rest of the world. Since 2014, the Seica Group includes Seica Automation, located in Milan, which designs and manufactures board handling systems and other automation equipment for the electronics manufacturing industry.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.