Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
YAMAHA Launches YSi-SP for Solder Paste Inspection
September 12, 2018 | Yamaha IMEstimated reading time: 1 minute
Yamaha Motor Corporation USA‘s intelligent machinery (IM) Division announces the launch of the YSi-SP, Yamaha Motor’s first advanced 3D solder paste inspection (SPI) machine. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto a PCB, offering true volumetric measurement and powerful process optimization capability.
The YSi-SP performs high-speed, high-accuracy 2D and 3D solder paste inspection with a single head, employing image high-resolution switch-over for exceptional flexibility in a single machine.
The YSi-SP seamlessly communicates with other Yamaha machines to perform such Industry 4.0 tasks as automatic changeover, solder misalignment adjustment, and automatic conversion of glue inspection data from the dispenser. This is all possible due to YAMAHA’s expertise as a manufacturer of a full lineup of integrated SMT assembly equipment.
While offering a comprehensive statistical process control (SPC) data package, the YSi-SP can also be equipped with various optional features including bonding and foreign matter inspection.
In making the announcement, George Babka, Sales General Manager, said, “The launch of the YSi-SP enables us to supply all of the primary machines required for mounting processes under the YAMAHA brand. This includes printers, dispensers, solder paste inspection, surface mounters and automated optical inspection (AOI) systems. This enables our customers to build their production lines with the highest capabilities, efficiency, and quality.”
Yamaha’s SMT Equipment will be on exhibit in booth #223 at SMTAI, October 16-17, 2018, at the Donald Stephens Convention Center in Rosemont, Illinois, USA.
About Yamaha Motor Intelligent Machinery
Yamaha Motor Corporation, USA IM is a subdivision of Yamaha Motor Corporation, and offers a full line of machines for electric/electronic parts mounting and other production-line solutions to answer the diversifying needs of today’s electronics manufacturers. Yamaha Motor Corporation, USA has sales and service offices in Japan, China, Southeast Asia, Europe and North America, providing a truly global sales and service network, delivering best in class on-site sales and service support for their customers.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.