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intelliFLEX Welcomes Jim Donnelly as Director of Programs
September 13, 2018 | intelliFLEXEstimated reading time: 1 minute
The intelliFLEX Innovation Alliance announced today that Jim Donnelly has joined the organization as director of Programs.
Donnelly is the former editor-in-chief of Ottawa Business Journal and, most recently, was director of Media Insights at Agility PR Solutions (formerly MediaMiser). He is a content creator, communicator and marketer with more than 15 years of professional experience creating, editing, and managing content, marketing and communications projects.
After earning his Master of Journalism degree from Carleton University, Donnelly spent two years backpacking across North America, Europe, and India before returning to Canada and working at publications such as Ottawa Magazine, Ottawa At Home, the Toronto Sun, and Frank Magazine.
As a marketing and communications consultant Jim has worked with several clients in the high-tech industry, along with occupying an advisory role with the Canadian Advanced Technology Alliance.
“We welcome Jim to intelliFLEX and encourage all intelliFLEX members to reach out to Jim with their needs and requirements,” says intelliFLEX CEO Peter Kallai. “Jim is an accomplished communicator and will help increase our members’ and industry’s visibility strategically by delivering the right programs at the right time.”
Donnelly succeeds Leo Valiquette, who held the role of director of Programs at intelliFLEX for the past four years.
About intelliFLEX
intelliFLEX, a not-for-profit industry alliance, is a vital partner for accelerating the growth of the printable, flexible and hybrid electronics sector of more than 300 organizations across Canada. Our technologies add intelligence and connect ordinary objects to enable the internet of everything. We unite our growing global membership to build an effective ecosystem of supply chains for flexible, 3D printable electronics, 2D large area printable electronics, wearable electronics, smart textiles and hybrid electronics including related semiconductors, integrated circuits and software. Our programs accelerate the adoption of these innovations for smart packaging and retail, intelligent buildings and connected homes, aerospace and defense, automotive and industrial applications, health and wellness, intelligent documents and wearables.
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